Surface-Mounted Electronic Element With Protruding Resin Leg Part
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Solution Overview
Problem
Conventional surface-mounted electronic devices face issues with heat dissipation due to substrate warpage, which can lead to short circuits and increased management costs, as the insulation gap between the electronic element and the heat sink decreases, potentially causing conductive contact and breakage.
Innovation Solution
The electronic element features a leg part molded from resin, protruding from the backside conductor part, which maintains an insulation gap even when the substrate warps, preventing short circuits and ensuring effective heat dissipation by supporting the heat sink and distributing reactive forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a greater distance between the electronic element and the heat sink is provided to assure sufficient insulation gap during substrate warped state, then the insulation gap is maintained, but the heat dissipation characteristics deteriorate
Solution Approach 1:
The support structure is segmented into multiple support parts distributed on the heat sink, each providing localized support to maintain insulation gap in different regions of the substrate, allowing the substrate to warp without compromising overall insulation while maintaining optimal heat dissipation distance
Solution Approach 2:
The support parts act as intermediary elements between the substrate and heat sink, providing mechanical support to maintain the insulation gap without requiring excessive distance, thus enabling both insulation reliability and effective heat dissipation
2Reliability
If height management and warpage management are performed in manufacturing process, then the insulation gap is maintained, but the management costs increase
Solution Approach 1:
The support parts are pre-installed on the heat sink before substrate mounting, creating a built-in mechanism that automatically maintains insulation gap regardless of substrate warpage, eliminating the need for complex post-manufacturing height and warpage management processes
Solution Approach 2:
The support parts provide self-adjusting support that automatically compensates for substrate warpage through their mechanical structure, making the system self-regulating and reducing the need for external management and control mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents short circuits and maintains effective heat dissipation characteristics by securing an insulation gap and reducing management costs, allowing for efficient production and reduced thickness of the heat dissipation material.
Implementation Method 1
A space between the back-side conductor part and the heat sink is filled with a heat conductive material, such as, a gel-like insulation heat dissipater
Implementation Method 2
The heat sink may serve as a separation of an electric connection path that connects the electronic element and the substrate from a heat dissipation path for transferring heat to the heat sink
Data Source
AI summary
An electronic element surface-mounted on a substrate has a leg part that protrudes from a back surface of the electronic element toward a heat sink along a peripheral portion of a back electrode. As such, if the substrate warps, the protruding leg part abuts a heat reception surface of the heat sink, thereby preserving an insulation gap between the back electrode and the heat sink. As a result, short-circuiting is prevented.