Electronic Device Frame Structure Waterproofing
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Solution Overview
Problem
Electronic devices with metallic structures face issues such as water ingress due to gaps between metallic and nonmetallic components, weight increase, and inadequate thermal and electrical conductivity, which affect durability and performance.
Innovation Solution
The electronic device incorporates a frame structure with an outer metallic portion and an inner nonmetallic portion, isolated from the inner metallic portion, using a junction layer to enhance bonding and durability, and a second junction layer to secure the nonmetallic portion, ensuring waterproof performance and improved conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metallic internal support member is used to provide structural strength and durability, then the device achieves a luxurious metallic appearance and improved strength, but water can ingress through gaps between the metallic structure and nonmetallic members, and the device weight increases
Solution Approach 1:
A waterproof adhesive layer is introduced as an intermediary between the metallic internal support member and the nonmetallic side cover. This adhesive layer fills and seals the gaps that would otherwise allow water ingress, while maintaining the structural integrity provided by the metallic support. The adhesive acts as a mediator that preserves both the strength benefit and eliminates the waterproofing problem.
2Strength
If a metallic internal support member is used to provide structural strength, then the device achieves improved durability, but the metallic material may not satisfy thermal and electrical conductivity requirements compared to other materials
Solution Approach 1:
The device employs a composite structure where a metallic internal support member provides structural strength, while a nonmetallic side cover and waterproof adhesive layer create a composite assembly that can be optimized for thermal and electrical properties. This allows the metallic component to fulfill its structural role without compromising the overall thermal and electrical conductivity requirements of the device.
3Adaptability or versatility
If an interface between metallic structure and nonmetallic member is created, then the device can combine metallic appearance with functional requirements, but the interface can be separated by shock caused by falling
Solution Approach 1:
A waterproof adhesive layer serves as an intermediary bonding agent between the metallic internal support member and the nonmetallic side cover. This adhesive intermediary provides enhanced bonding strength that can withstand shock and impact forces, preventing separation at the interface while maintaining the design flexibility to combine different materials for aesthetic and functional purposes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents water ingress, enhances durability, and meets thermal and electrical conductivity requirements, improving the overall performance and reliability of the electronic device.
Implementation Method 1
using a junction layer to enhance bonding and durability
Implementation Method 2
using a second junction layer to secure the nonmetallic portion, ensuring waterproof performance
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
An electronic device is provided. The electronic device includes a frame structure, and the frame structure includes an outer metallic portion including a first metallic material and forming at least a portion of an outer surface of the electronic device, and an inner metallic portion including a second metallic material different from the first metallic material and laterally surrounded by the outer metallic portion, and a first inner polymeric portion isolated from the inner metallic portion and at least partially laterally surrounded by the outer metallic portion. The electronic device includes a wireless communication circuit electrically connected to a portion of the outer metallic portion.