Electronic Fuse Gate Layout for Precise Blow Position Detection

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Solution Overview

Problem

Existing electronic fuse devices face challenges in ensuring accurate detection and minimization of blown positions, as well as efficient implementation, particularly in the context of high voltage applications.

Innovation Solution

The electronic fuse device incorporates a substrate with specific doping regions and a highly doped region of a different conductivity type, along with a pass gate and readout electrode, to ensure precise detection and control of blowing positions, utilizing a silicon oxide insulating layer and spacers for minimal dimensions and ease of implementation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a conventional electronic fuse device structure is used, then the device can provide basic fuse functionality, but the detection accuracy of blown positions is insufficient and device dimensions are not minimized

Engineering Contradiction:
Improvedetection accuracyVSAvoiddevice structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The substrate is divided into multiple doping regions (first, second, and third doping regions) with different conductivity types, creating distinct channels that can be independently controlled and detected. This segmentation allows precise identification of blown positions while maintaining a compact structure through systematic region划分.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are assigned different doping concentrations and conductivity types to create localized functional zones. The highly doped region provides specific electrical characteristics for detection, while other regions are optimized for fuse operation. This local differentiation enables accurate detection without requiring complex overall device architecture.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If the device structure is simplified to reduce dimensions, then ease of implementation improves, but detection capability may be compromised

Engineering Contradiction:
Improveease of implementationVSAvoiddetection capability
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The highly doped region serves multiple functions: it acts as a detection element for blown positions, provides electrical isolation between channels, and contributes to the overall device functionality. This multi-functionality reduces the need for separate detection structures, simplifying manufacturing while maintaining detection capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The insulating layer positioned between the substrate and gate structures serves as an intermediary that enables electrical isolation and signal transmission. This intermediate structure facilitates both the fuse operation and detection functions without requiring direct contact between all components, thereby simplifying the overall device architecture.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Measurement precision

If multiple doping regions are introduced to improve detection, then detection accuracy improves, but device complexity increases

Engineering Contradiction:
Improvedetection accuracyVSAvoiddoping region structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The first, second, and third doping regions are integrated into a single substrate structure with systematic arrangement. The gate structures are positioned to simultaneously interact with multiple doping regions, merging the fuse and detection functions into a unified device architecture rather than separate components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The doping regions are arranged in a spatial pattern that utilizes vertical and lateral dimensions efficiently. By positioning regions at different locations and depths within the substrate, the design achieves high detection accuracy without proportionally increasing planar device area, effectively using three-dimensional space.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables accurate detection of all intended blowing positions with reduced device dimensions, enhancing detection accuracy and ease of implementation by isolating channels and using a common electrode for voltage application, thus improving operational efficiency.

Implementation Method 1

an insulating layer positioned on the substrate

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

the highly doped region is a second conductivity type different from the first conductivity type

Methodology Applied
Scientific EffectElectrical conductivity: Conduction (electrical)

Data Source

PatentUS12610814B2Electronic fuse device including fuse gate, pass gate, and doping regions
Publication Date: 2026.04.21 NAN YA TECH
  • US12610814B2 patent drawing
  • US12610814B2 patent drawing
  • US12610814B2 patent drawing

AI summary

An electronic fuse device includes a substrate, an insulating layer on the substrate, a first fuse gate, a first pass gate, and a first readout electrode. The substrate includes a first doping region, a second doping region, and a third doping region having a first conductivity type, and a highly doped region having a second conductivity type different from the first conductivity type. The first doping region is between the second doping region and the highly doped region. The second doping region is between the first doping region and the third doping region. The first fuse gate is on the insulating layer and between the first doping region and the second doping region. The first pass gate is on the insulating layer and between the second doping region and the third doping region. The first readout electrode is electrically connected to the third doping region.