Electronic Housing With Movable Air Inlet Cooling
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Solution Overview
Problem
Existing electronic device housings with fixed airflow channels struggle to meet varying cooling requirements due to inflexible airflow structures.
Innovation Solution
A housing design incorporating a movable assembly with adjustable airflow channels, featuring movable parts that can expand or contract the air inlet area to accommodate varying heat dissipation needs, utilizing mechanisms like hinges, snap-fits, and drive parts for controlled airflow adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If fixed airflow channels are used in the housing, then the structure is simple and easy to manufacture, but the cooling efficiency cannot be adjusted to meet varying heat dissipation requirements
Solution Approach 1:
The patent applies the dynamics principle by transforming the fixed airflow channel structure into a movable one. The airflow channel includes a movable part that can change its position relative to the housing body, allowing the flow area to be adjusted dynamically. This enables the cooling system to adapt to different heat dissipation requirements while maintaining a relatively simple overall structure.
Solution Approach 2:
The airflow channel is segmented into a fixed part and a movable part. The movable part can be independently adjusted to change the flow area, while the fixed part maintains the structural integrity. This segmentation allows for adjustable cooling efficiency without significantly increasing the overall device complexity.
2Temperature
If the airflow channel flow area is increased to improve cooling, then the cooling efficiency improves, but the device volume increases
Solution Approach 1:
The patent uses a movable part within the airflow channel that can change position to adjust the flow area dynamically. When high cooling is needed, the movable part shifts to increase the flow area; when low cooling is sufficient, it reduces the flow area. This dynamic adjustment allows effective cooling without permanently increasing the housing volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adjustable airflow channels effectively adapt to different heat dissipation demands, enhancing cooling efficiency by optimizing airflow volume based on the electronic element's heat generation, thereby maintaining optimal operating temperatures.
Implementation Method 1
The housing is designed with airflow channels that allow air to pass through and carry away heat from the electronic elements
Implementation Method 2
air to pass through and carry away heat from the electronic elements, thereby cooling down the electronic elements
Data Source
AI summary
A housing includes a housing body and a movable assembly. The housing body includes an airflow channel extending along a first direction. The airflow channel includes an accommodation position for accommodating an electronic element. An air inlet of the airflow channel is formed on an end of the housing body along the first direction. A gap is formed on at least one side of the housing body parallel to the first direction. The movable assembly is arranged at the gap and includes at least one movable part. One movable part of the at least one movable part is connected to the housing body. The remaining movable parts of the at least one movable part are movably connected in sequence. At least some movable parts move toward or away from the housing body to change a flow area of the air inlet.