Electronic Housing With Bending Metal Cover And Plastic Frame
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Solution Overview
Problem
Existing electronic housings for devices like PCMCIA or PC cards face challenges in manufacturing due to mechanical robustness, internal volume, and assembly efficiency, with over-molded enclosures being costly, snap-together enclosures being less robust, and adhesively bonded ones being slow and volume-constrained.
Innovation Solution
A cover assembly design featuring a frame with offset mating surfaces and edge members with primary and secondary recesses for easy bending, combined with injection molded plastic frames and stamped sheet metal covers, allowing for efficient assembly and high internal volume, suitable for mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If over-molded enclosures are used, then mechanical strength is improved, but manufacturing cost increases due to labor-intensive process
Solution Approach 1:
The enclosure is divided into separate frame and cover components that are manufactured independently using injection molding and stamping processes, then assembled through bending and mechanical fastening. This segmentation eliminates the labor-intensive over-molding process while maintaining structural integrity through the rigid frame-bendable cover design.
Solution Approach 2:
The cover is designed with bendable edge members that have specific geometric features (recesses, tabs, scoring lines) enabling controlled deformation during assembly. By changing the physical state from rigid to flexibly rigid through strategic bending zones, the cover achieves secure attachment to the frame without requiring complex over-molding operations.
2Ease of manufacture
If snap-together enclosures are used, then manufacturing cost decreases, but mechanical robustness deteriorates
Solution Approach 1:
The cover edge members incorporate curved bending zones and recesses that distribute mechanical stresses during assembly and operation. The bent configuration creates a snap-fit action that engages with the frame, providing robust mechanical attachment comparable to or exceeding traditional snap-together designs while maintaining ease of manufacture.
Solution Approach 2:
The cover edge members are pre-formed with recesses, tabs, and scoring lines during the stamping process that prepare them for controlled bending during assembly. This preliminary preparation ensures consistent, robust attachment to the frame while maintaining a simple manufacturing process suitable for mass production.
3Device complexity
If adhesively bonded enclosures are used, then assembly process is simplified, but internal volume decreases and assembly time increases due to curing time
Solution Approach 1:
The cover edge members are designed to self-align and self-secure to the frame through their bent configuration. The recesses and tabs create automatic engagement features that guide the assembly process without requiring adhesive application or curing time, eliminating the volume loss and time delay associated with adhesive bonding.
Solution Approach 2:
The mechanical bending and engagement system replaces the chemical adhesive bonding process. The bent edge members create friction-fit and snap-fit connections with the frame that provide equivalent or superior attachment strength without requiring adhesive materials, thereby preserving internal volume and eliminating curing time.
4Volume of stationary object
If thin metal covers are used, then internal volume is maximized, but structural strength deteriorates
Solution Approach 1:
The cover transitions from a completely rigid structure to a dynamically adaptable component with controlled flexible zones. The bendable edge members with recesses and scoring lines allow the thin metal cover to deform during assembly for secure attachment, then maintain structural integrity during operation, achieving both maximum internal volume and adequate strength.
Solution Approach 2:
The thin metal cover incorporates localized reinforcement through bent edge members with specific geometric features (recesses, tabs, flanges) at critical attachment zones. These local structural enhancements provide necessary strength at connection points while maintaining overall thinness to maximize internal volume throughout the enclosure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of robust, cost-effective electronic housings with large internal volumes, facilitating rapid and consistent assembly, addressing the limitations of existing enclosure designs.
Implementation Method 1
each edge member configured such that, when the edge member is bent at the primary recess at a substantially perpendicular angle
Implementation Method 2
A cover assembly design featuring a frame with offset mating surfaces and edge members with primary and secondary recesses for easy bending, combined with injection molded plastic frames and stamped sheet metal covers
Data Source
AI summary
An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.