Electronic Device Housing with Aligned Fiber Layers
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Solution Overview
Problem
Carbon fiber material used in electronic device housings for 3C products has a shielding effect on electromagnetic signals, making it unsuitable for antenna areas, and existing solutions involving carbon fiber and plastic combinations require additional processing steps, increasing costs and reducing yield rates due to interface issues.
Innovation Solution
A housing manufactured using multiple layers of fiber materials, where the fiber directions are aligned to hide the splicing face, allowing for a seamless integration of carbon fiber and non-conductive fiber materials, reducing shielding effects on antennas and eliminating the need for additional processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If carbon fiber material is used for housing to achieve light and thin performances, then weight and appearance quality are improved, but electromagnetic signal shielding increases making it unsuitable for antenna areas
Solution Approach 1:
The housing is divided into multiple layers with different fiber materials. The first layer uses carbon fiber material for weight reduction and aesthetic appearance, while the second layer uses non-conductive fiber material to provide electromagnetic wave transmission channels for the antenna, thus segmenting the functional requirements of different regions.
Solution Approach 2:
Different regions of the housing are assigned different material properties. The first region (outer layer) uses carbon fiber material optimized for appearance and weight, while the second region (inner layer near antenna) uses non-conductive fiber material optimized for electromagnetic wave transmission, ensuring each region has the appropriate local quality for its function.
2Object-affected harmful factors
If plastic material is used for antenna area to reduce shielding effect, then electromagnetic signal transmission is improved, but additional processing steps and adhesive steps are required increasing complexity and cost
Solution Approach 1:
The housing is constructed as an integrated multi-layer structure where the first layer (carbon fiber) and second layer (non-conductive fiber) are combined in a single manufacturing process. This merging eliminates the need for separate adhesive steps and subsequent interface treatments, reducing manufacturing complexity while maintaining the electromagnetic wave transmission function.
Solution Approach 2:
The housing uses a composite structure of different fiber materials arranged in layers. The combination of carbon fiber material and non-conductive fiber material creates a composite housing that simultaneously achieves aesthetic appearance, weight reduction, and electromagnetic wave transmission, avoiding the need for plastic inserts and complex assembly processes.
3Object-affected harmful factors
If carbon fiber material and plastic portion are adhered together to form housing, then antenna area functionality is achieved, but yield rate decreases and cost increases due to interface treatment requirements
Solution Approach 1:
The multi-layer housing structure is manufactured as an integrated unit in a single molding process, merging the carbon fiber layer and non-conductive fiber layer without requiring adhesive bonding. This eliminates interface defects and associated rework, thereby improving yield rate and reducing production costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a single-piece housing design with reduced shielding effects on antennas, lowering production costs and improving yield rates by eliminating the need for subsequent treatments and additional adhesive steps.
Implementation Method 1
placing the laminated N layers of fiber material into a mold and thermo pressing and solidifying the laminated N layers of fiber material therein
Implementation Method 2
laminating N layers of fiber material, each of which is made of a first fiber material and a second fiber material
Data Source
AI summary
Embodiments of the present application provide an electronic device and a method of manufacturing a housing for the electronic device, which belong to a field of electronic product. The electronic device comprises a housing and an antenna. The housing comprises N layers each of which is made of a first fiber material and a second fiber material; and the housing comprises a first region, and a second region made of the second fiber material. In the N layers, a first layer has a first fiber direction and comprises the first fiber material and the second fiber material, and a fiber direction of the first fiber material in the first layer is consistent with the first fiber direction, and a fiber direction of the second fiber material in the first layer is consistent with the first fiber direction, wherein a first splicing face where the first fiber material and the second fiber material in the first layer are spliced is parallel to the first fiber direction, and is hidden in the first layer so that when the first layer is formed as an outer surface of the housing, the housing is formed into one piece. The antenna is securely disposed in the housing and comprises a radiator in the second region, wherein a shielding influence value of the second fiber material on the radiator is less than a shielding influence value of the first fiber material on the radiator.