Electronic Device Housing Reinforcement for Impact Resistance

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Solution Overview

Problem

Metal housings of electronic devices with heterogeneous adhesive structures are prone to damage from impacts, such as falls, leading to manufacturing issues like color loss, cracking, and reduced rigidity and yield.

Innovation Solution

A reinforcing structure is added at the bonded portions between heterogeneous materials in the metal housing to expand the bonding area and strengthen adhesive force, enhancing impact resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a heterogeneous adhesive structure is used to form the metal housing, then antenna performance is improved, but impact resistance deteriorates

Engineering Contradiction:
Improveantenna performanceVSAvoidimpact resistance
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent applies composite materials by combining metal structures with non-metal structures in a heterogeneous adhesive structure. The metal portions provide structural strength and antenna functionality, while the non-metal portions (such as polymer members) provide impact resistance and bonding surfaces. This composite approach allows the housing to simultaneously achieve good antenna performance through the metal conductive structures and improved impact resistance through the non-metal bonding portions.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If a heterogeneous bonding structure is used to form the metal housing, then manufacturing flexibility is improved, but manufacturing precision deteriorates

Engineering Contradiction:
Improvemanufacturing flexibilityVSAvoidbonding precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent uses an adhesive member as an intermediary substance between the metal structure and the non-metal structure. This adhesive mediator facilitates the bonding process by providing a compatible interface between heterogeneous materials, improving manufacturing flexibility. The adhesive member compensates for surface irregularities and material incompatibilities, thereby maintaining bonding precision despite the heterogeneous nature of the structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If a segmented-type structure is used for the housing, then antenna arrangement is improved, but structural integrity deteriorates

Engineering Contradiction:
Improveantenna arrangementVSAvoidstructural integrity
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent applies the nesting principle by placing the non-metal structure within or between the metal structures of the segmented housing. The non-metal polymer member is positioned to fill gaps and connect metal segments, creating a nested configuration where the weaker non-metal material is protected by and integrates the metal segments. This nesting approach maintains structural integrity by providing continuous material support across the segmented joints while preserving the antenna arrangement benefits of the segmented structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The reinforcing structure improves the impact resistance of the metal housing by increasing the contact area and adhesive force between different materials, thereby reducing damage and manufacturing defects.

Implementation Method 1

a adhesive member for attachment of the front cover or the rear cover is disposed

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

A reinforcing structure is added at the bonded portions between heterogeneous materials in the metal housing to expand the bonding area and strengthen adhesive force

Methodology Applied
Scientific EffectMechanical bonding: Mechanical Fastener

Data Source

PatentEP4266657B1Electronic device including impact resistance-reinforcing structure
Publication Date: 2025.09.24 SAMSUNG ELECTRONICS CO LTD
  • EP4266657B1 patent drawingFigure 1
  • EP4266657B1 patent drawingFigure 2
  • EP4266657B1 patent drawingFigure 3

AI summary

An electronic device including at least one impact resistance-reinforcing structure may be disclosed herein. The disclosed electronic device includes: a first plate disposed to face in a first direction; a second plate disposed to face in a second direction opposite to the first direction; and a housing including a side member disposed so as to surround at least a portion of the space between the first and second plates, wherein the housing may include: a first metal material part; a second metal material part spaced apart from the first metal material part; a first reinforcing structure which is formed in the first metal material part and disposed adjacent to an edge portion of the housing; and a non-metal material part which is a structure integrally injection-molded between the first and second metal material parts and connecting the first and second metal material parts, is large enough to cover the first reinforcing structure, and is adhered to the first reinforcing structure. Various other embodiments are possible.