Electronic Device Housing With Segmented Airflow for Heat Sink Cooling

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Solution Overview

Problem

Existing electronic devices struggle to efficiently cool electronic components using air intake and exhaust systems, leading to inefficient heat dissipation.

Innovation Solution

The device incorporates a housing with separate ventilation spaces and a fan system that directs outside air through a ventilation port to a heat sink, using cushion rubbers to seal gaps and ensure efficient airflow, thereby cooling the electronic components effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If ventilation holes are provided in the housing to intake and exhaust air, then air circulation is enabled, but air leakage occurs and cooling efficiency deteriorates

Engineering Contradiction:
Improveair circulationVSAvoidcooling efficiency
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The ventilation system is segmented into separate intake and exhaust pathways. The lid defines a sealed second space section with dedicated ventilation holes for intake, while the housing provides separate exhaust holes. This segmentation prevents air leakage and ensures efficient unidirectional airflow through the heat sink, resolving the contradiction between enabling air circulation and maintaining cooling efficiency.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the lid is made sealed to prevent air leakage, then cooling efficiency is improved, but airflow restriction occurs

Engineering Contradiction:
Improvecooling efficiencyVSAvoidairflow rate
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The lid is designed with localized ventilation features including ventilation holes and a ventilation port that aligns with the fan. This local quality allows controlled airflow where needed while maintaining overall sealing to prevent leakage. The combination of sealed surfaces and localized openings optimizes both cooling efficiency and airflow rate.

Inventive Principle:
Principle #3Local quality

3Ease of operation

If ventilation holes are provided in the lid, then air intake is enabled, but air leakage occurs

Engineering Contradiction:
Improveair intakeVSAvoidair leakage prevention
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The lid's ventilation system is segmented into discrete ventilation holes and a separate ventilation port. The ventilation holes provide controlled air intake while the ventilation port serves as a dedicated exhaust pathway for the fan. This segmentation prevents air leakage by ensuring that intake and exhaust flows are spatially separated and controlled.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the cooling efficiency of electronic components by minimizing air leakage and ensuring effective heat dissipation, reducing the load on the components and improving overall cooling performance.

Implementation Method 1

a fan provided in the first space section and configured to cool the heat sink with a flow of air caused by the fan rotating

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

a heat sink provided in the first space section and configured to radiate heat generated from an electronic component housed in the housing

Methodology Applied
Scientific EffectThermal Radiation: Thermal Radiation

Data Source

PatentUS12446177B2Electronic device
Publication Date: 2025.10.14 TOSHIBA TEC KK
  • US12446177B2 patent drawing
  • US12446177B2 patent drawing
  • US12446177B2 patent drawing

AI summary

An electronic device in an embodiment includes a housing including a hollow first space section with one surface of the hollow first space section opened and including a first ventilation hole, a lid provided to close the opening of the housing, including a hollow second space section, and including a second ventilation hole, a heat sink provided in the first space section and configured to radiate heat generated from an electronic component housed in the housing, and a fan provided in the first space section and configured to cool the heat sink with a flow of air caused by the fan rotating. The lid includes a ventilation port in a position facing the fan and separates the first space section and the second space section excluding the ventilation port.