Electronic-Integration Compatible Photonic Integrated Circuit

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Solution Overview

Problem

Current photonic integrated circuit technology faces challenges in achieving large-scale integration of photonic devices on a chip, including incompatibility with electronic device integration, difficulty in low-loss and cost-effective optical coupling, and integration of optoelectronic and nanophotonic devices, which hinders the development of high-performance photonic systems.

Innovation Solution

The development of an electronic-integration-compatible photonic integrated circuit (EIC-PIC) that integrates active and passive photonic devices using monolithic integration techniques, including single and double optical layer structures, with optical waveguiding layers and transparent conducting oxide electrodes, enabling efficient coupling of light and integration with electronic devices on a single substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If monolithic integration techniques are used to integrate photonic devices on a single substrate, then device integration density is improved, but compatibility with electronic device fabrication processes deteriorates

Engineering Contradiction:

Improvedevice integration densityVSAvoidcompatibility with electronic device fabrication processes

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The photonic integrated circuit is divided into multiple functional layers including a first optical waveguide layer for light propagation and a second optical waveguide layer for light coupling, with each layer performing specific functions. This segmentation allows each layer to be optimized independently while maintaining overall system compatibility with electronic fabrication processes

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A coupling structure is introduced as an intermediary element between the first and second optical waveguide layers to facilitate light coupling. This intermediary component enables efficient optical coupling while maintaining compatibility with standard semiconductor fabrication techniques, bridging the gap between photonic functionality and electronic manufacturing processes

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If optical coupling structures are added to enable low-loss light coupling, then optical coupling efficiency is improved, but device complexity increases

Engineering Contradiction:

Improveoptical coupling efficiencyVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The coupling structure is integrated directly into the waveguide layer structure, merging the coupling function with the existing waveguide architecture. This integration approach enables low-loss optical coupling without adding separate, complex coupling components, thereby reducing overall device complexity while maintaining high coupling efficiency

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If multiple optical layers are integrated to enable active photonic devices, then photonic functionality is improved, but manufacturing difficulty increases

Engineering Contradiction:

Improvephotonic functionalityVSAvoidmanufacturing difficulty

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The optical waveguide layers are designed to serve multiple functions: light propagation, light coupling, and integration with active photonic devices such as lasers and modulators. This multi-functionality approach enables diverse photonic functionalities to be achieved using the same basic layer structure and fabrication processes, reducing manufacturing difficulty while enhancing photonic capabilities

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the creation of high-data-rate signal processing and communication systems, enabling compact, high-performance photonic devices that are compatible with electronic integration, facilitating advanced applications in computing, sensing, and communication.

Implementation Method 1

optical waveguiding layers

Methodology Applied

Scientific EffectOptical waveguiding: Waveguide (optics)

Implementation Method 2

transparent conducting oxide electrodes

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

transparent conducting oxide electrodes

Methodology Applied

Scientific EffectOptical transparency:

Data Source

PatentUSRE48379E1Electronic-integration compatible photonic integrated circuit and method for fabricating electronic-integration compatible photonic integrated circuit

Publication Date: 2021.01.05 ELECTRONICS PHOTONIC IC INC EPIC INC

AI summary

An electronic-integration compatible photonic integrated circuit (EIC-PIC) for achieving high-performance computing and signal processing is provided. The electronic-integration compatible photonic integrated circuit comprises a plurality of electronic circuit structures and a plurality of photonic circuit structures. The electronic and photonic circuit structures are integrated by a process referred to as monolithic integration. An electronic circuit structure includes one or more electronic devices and a photonic circuit structure includes one or more photonic devices. The integration steps of electronic and photonic devices are further inserted into standard CMOS process. The photonic circuit structures and the electronic circuit structures are integrated to form the electronic-integration compatible photonic integrated circuit device.