Electronic Apparatus Electrical Joint Damage Monitoring
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Solution Overview
Problem
Existing techniques fail to accurately predict the lifespan of electronic apparatuses under composite thermal and dynamic loads, particularly in semiconductor modules, where the electrical joints are prone to fracture due to heat generation and stress variations, leading to inadequate detection of impending failures.
Innovation Solution
The electronic apparatus incorporates a measuring module that monitors electrical characteristic values, such as resistance, across multiple electrodes and joints, allowing for early detection of damage and fracture risk by measuring changes in capacitance or impedance before a fatal failure occurs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If health monitoring techniques are used to predict life to failure, then reliability is improved, but measurement precision deteriorates when composite loads are applied
Solution Approach 1:
The patent divides the electrical joint into multiple measurement points (first measurement point and second measurement point) along the connection path. By segmenting the monitoring into multiple locations, the system can detect damage more precisely at specific critical areas where fractures are most likely to occur, thereby improving measurement precision while maintaining reliability.
Solution Approach 2:
The patent introduces a measuring module as an intermediary device that measures electrical characteristic values (such as resistance or impedance) at multiple points along the connection path. This intermediary measurement system enables precise detection of damage states without directly observing the fracture, allowing accurate life prediction even under complex composite loading conditions.
2Ease of manufacture
If electrical joints are used to connect components, then ease of manufacture is improved, but reliability deteriorates due to heat generation and stress
Solution Approach 1:
The patent implements preliminary monitoring of electrical characteristic values at multiple points along the connection path before actual fracture occurs. By detecting changes in resistance or impedance in advance, the system can predict potential failures and take preventive measures, thereby improving the reliability of electrically connected components while maintaining the simplicity of the connection structure.
Solution Approach 2:
The patent establishes a feedback mechanism where measured electrical characteristic values are continuously monitored and compared against reference values. When changes indicate developing damage, the system provides feedback to detect the damage state, enabling proactive maintenance and improving joint durability without complicating the manufacturing process.
3Reliability
If repeated loads are applied to test durability, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent enables the electrical joint to essentially monitor itself by measuring its own electrical characteristic values (resistance, impedance) at multiple points. The joint's electrical properties serve as the sensing mechanism, eliminating the need for separate complex mechanical sensors or extensive testing equipment, thereby improving reliability assessment while keeping the monitoring system simple.
Solution Approach 2:
The patent replaces complex mechanical monitoring systems with electrical measurement. Instead of using mechanical sensors to detect physical damage, the system uses electrical characteristic measurements (resistance, impedance) at multiple points to infer the damage state. This substitution simplifies the overall system complexity while providing reliable fatigue life assessment under repeated loading.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables preliminary detection of damage and fracture in electrical joints, enhancing the prediction of lifespan and preventing catastrophic failures by sensing changes in electrical characteristics before they reach a critical level.
Implementation Method 1
measuring changes in resistance and impedance
Implementation Method 2
measuring changes in resistance and impedance
Implementation Method 3
bonded through a thin-film metal bonding layer
Implementation Method 4
a large amount of heat is locally caused on the connection surface of the semiconductor device and the conductive member
Implementation Method 5
repeated stress to a electrical joint (e.g., a electrical joint between a device and an electrode, or a solder electrical joint) by a difference in a linear expansion coefficient between components
Implementation Method 6
the repeated stress is generated due to an application of inertia force
Data Source
AI summary
According to an embodiment, an electronic apparatus includes a first member serving as a circuit board member; a second member serving as a circuit board member or a semiconductor device; a first electrode formed on the first member; a second electrode formed on a region, of the first member, around a region where the first electrode is formed; and a third electrode formed on the second member. The electronic apparatus also includes a electrical joint configured to bond the first electrode, the second electrode, and the third electrode; and a measuring module configured to measure an electrical characteristic value of a connection path including at least one of the first electrode and the second electrode.