Electronic Device Key With Separated Substrate And Adhesive Bonding
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Solution Overview
Problem
Conventional electronic device keys have limited material selection due to complex craftwork and low structural strength, making it difficult to achieve a balance between strength and size, often requiring thick plastic or metal keys that occupy excessive space.
Innovation Solution
A key with a separated structure where the key cap and substrate are formed separately and adhesively attached, allowing for flexible material selection and reduced thickness, including options like carbon fiber, glass, or rubber substrates, while ensuring strength through double substrate sheets and layered adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the key cap and substrate are formed integrally, then the structural strength is improved, but the material selection is limited and the thickness increases
Solution Approach 1:
The key is divided into two separate components: a key cap and a substrate. These components are formed separately using different materials and then assembled together through adhesive bonding. This segmentation allows independent optimization of each component's material properties while maintaining overall structural integrity.
2Strength
If the key cap and substrate are formed integrally, then the structural strength is improved, but the machining complexity increases
Solution Approach 1:
The key is divided into two separate components: a key cap and a substrate. These components are formed separately using different materials and then assembled together through adhesive bonding. This segmentation allows independent optimization of each component's material properties while maintaining overall structural integrity.
3Strength
If a thick key is used to satisfy strength requirements, then the structural strength is improved, but the device size and installation space increase
Solution Approach 1:
The key utilizes composite construction with a key cap made from one material and a substrate made from another material. This allows each component to contribute its optimal properties: the key cap provides surface functionality while the substrate provides structural support with high strength-to-thickness ratio, enabling thin overall design without compromising strength.
4Adaptability or versatility
If the key cap and substrate are formed separately and adhesively attached, then the material selection flexibility is improved, but the manufacturing complexity increases
Solution Approach 1:
The key cap and substrate are joined together through adhesive bonding to form an integrated key assembly. This merging of separate components creates a unified structure that functions as a single unit while retaining the advantages of material diversity and independent component optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies machining, enables flexible material choice, achieves a smaller size, and reduces installation space while maintaining sufficient strength, addressing the limitations of conventional integral key designs.
Implementation Method 1
The substrate is adhesively attached to an underside of the key cap with an adhesive
Data Source
AI summary
A key of an electronic device and an electronic device applying the key are provided. The key includes a key cap and a substrate arranged under the key cap, the key cap and the substrate are formed separately, and the substrate is adhesively attached to an underside of the key cap with an adhesive.