Electronic Element Layout Structure for High-Density Testing

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Solution Overview

Problem

The existing semiconductor process faces challenges in efficiently accommodating and testing a high number of electronic elements in a limited area due to the decreasing size of critical dimensions, leading to insufficient space for test keys during wafer acceptance tests.

Innovation Solution

A high density layout structure for electronic elements is proposed, where M*N elements are arranged in a matrix with multiple test pad groups on opposite sides, allowing all elements in a linear section to share electrodes and be connected to corresponding test pads, enabling efficient use of space and facilitating detection through addressing methods.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the critical dimension of electronic elements is reduced to lower production cost, then the number of elements that can be accommodated increases, but the available area for test keys becomes insufficient

Engineering Contradiction:

Improvenumber of electronic elements testedVSAvoidavailable area for test keys

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

Multiple test pads are merged into test pad groups positioned at the sides of the electronic element matrix. Elements in the same linear section share common electrodes connected to corresponding test pads, consolidating multiple testing functions into shared structures to maximize space utilization

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The test pad arrangement transitions from traditional top/bottom configurations to side-positioned groups along the linear section. This dimensional repositioning allows test pads to be located in previously underutilized side regions, effectively increasing the usable testing area without expanding the overall footprint

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If more electronic elements are arranged in a linear section to increase testing capacity, then the area occupied per element decreases, but the complexity of electrical testing increases

Engineering Contradiction:

Improvenumber of electronic elements per linear sectionVSAvoidcomplexity of electrical testing

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

Test pads serve multiple functions: they act as common electrodes for elements in the same linear section, provide selective addressing capability, and enable both activation and detection operations. This multi-functionality reduces the total number of dedicated test structures needed

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The electronic elements are segmented into linear sections that can be independently addressed and tested. Each linear section shares common electrodes with elements in the same section, allowing systematic testing through divided operational units rather than treating all elements uniformly

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS8179155B2Layout structure of electronic elements and method for addressing to detect electronic elements

Publication Date: 2012.05.15 UNITED MICROELECTRONICS CORP

AI summary

A layout structure of electronic elements includes M*N electronic elements in a form of a matrix, a first test pad group disposed on a first side of the matrix and all electronic elements in the same linear section in the matrix electrically connect to a corresponding test pad in the first test pad group, and a second test pad group disposed on a second side of the matrix and all electronic elements in the same linear section in the matrix electrically connect to a corresponding test pad in the second test pad group.