Electronic Module Conductive Pattern Layer Gluing
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Solution Overview
Problem
Conventional methods for manufacturing electronic modules with semiconductor components are complex, costly, and prone to mechanical stress issues, especially in smaller devices, due to the need for component packaging and soldering, which can lead to reliability problems and increased costs.
Innovation Solution
A method involving gluing semiconductor components directly to a conductive layer, forming insulating layers around them, and creating feed-throughs for electrical connections without soldering, using a simplified process that requires fewer materials and reduces mechanical stress by using a conductive pattern layer for connections, allowing for denser and more reliable module construction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional component packaging and soldering methods are used, then electrical connections are established, but mechanical stress and reliability problems occur
Solution Approach 1:
The patent extracts the soldering process from the connection method, replacing it with direct mechanical attachment through recesses and adhesive bonding. This eliminates the harmful thermal and mechanical effects of soldering while maintaining electrical connectivity through conductive paths in the adhesive layer.
Solution Approach 2:
The patent introduces an adhesive layer as an intermediary between the component and the circuit board. This adhesive serves multiple functions: mechanical bonding, stress distribution, and electrical conduction, replacing the traditional solder joint and eliminating soldering-related reliability issues.
2Reliability
If component cases are used for protection and handling, then component reliability is improved, but device size and cost increase
Solution Approach 1:
The patent merges the component case function with the circuit board structure itself. The recesses in the circuit board provide mechanical support and protection previously requiring separate cases, while the adhesive layer provides both bonding and protection. This integration eliminates unnecessary packaging components and reduces overall device volume.
Solution Approach 2:
The circuit board is designed to perform multiple functions: electrical connectivity, mechanical support, component mounting, and protection. The recesses serve both as mounting locations and as protective structures, eliminating the need for separate protective cases while maintaining component reliability.
3Volume of moving object
If flip-chip technology is used to eliminate packaging, then device size is reduced, but mechanical stress and connection reliability worsen
Solution Approach 1:
The adhesive layer acts as a compliant intermediary between the flip-chip component and the rigid circuit board. This adhesive layer absorbs and distributes mechanical stresses, preventing the stress concentration that would otherwise compromise connection reliability in flip-chip configurations.
Solution Approach 2:
The patent changes the mechanical parameters of the connection interface by using a soft, compliant adhesive layer instead of rigid solder joints. This parameter change allows the system to accommodate thermal expansion and mechanical stress while maintaining reliable electrical connections in a compact flip-chip configuration.
4Strength
If multiple materials and process stages are used for durable connections, then connection strength is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The adhesive layer is designed to perform multiple functions simultaneously: mechanical bonding, stress distribution, electrical conduction, and alignment tolerance compensation. This multi-functionality eliminates the need for separate materials and process stages for each function, simplifying the manufacturing process while maintaining connection durability.
Solution Approach 2:
The patent combines multiple functions into a single adhesive layer application process. Instead of requiring separate steps for mechanical attachment, electrical connection, and stress management, all these functions are achieved through the single adhesive bonding operation, significantly reducing manufacturing complexity.
Data Source
AI summary
This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.