Electronic Module Connector Stabilization via Vertical Dimensioning
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Solution Overview
Problem
Conventional electronic modules face challenges in reliably connecting control electrodes (gate electrodes) due to their smaller size, leading to potential defects and reduced controllability and reliability of the electronic module.
Innovation Solution
The electronic module design includes a rear surface-exposed conductor and a rear surface-unexposed conductor with specific geometric configurations, such as increased thickness distance between connector parts, to stabilize the connection of the second connector, preventing defective connections and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the control electrode is connected to the connector, then the electronic element becomes controllable, but the connection is unstable and the connector may fall sideways due to the small size of the control electrode
Solution Approach 1:
The patent introduces a distance H in the thickness direction between the connection base part and connection tip part, creating a three-dimensional structural constraint. This vertical dimensionality change prevents the connector from falling sideways by ensuring that the distance H is larger than the width W of the connection tip part, thereby stabilizing the connection without complicating the horizontal layout
Solution Approach 2:
The patent changes the geometric parameters of the connector structure by defining specific relationships between dimensions: the distance H in the thickness direction must be larger than the width W of the connection tip part. This parameter change ensures that the connector tip sinks properly into the conductive adhesive and maintains stable electrical connection
2Reliability
If the connector is designed with sufficient distance H between connection base part and tip part, then the connection stability improves, but the overall connector size increases
Solution Approach 1:
Instead of increasing the horizontal footprint of the connector, the patent utilizes the vertical thickness direction to create the stabilizing distance H. This allows the connector to achieve stability through vertical dimensioning rather than horizontal expansion, thereby minimizing the overall volume increase while maintaining connection reliability
3Reliability
If the second connector tip sinks into the conductive adhesive, then the connection becomes stable, but the manufacturing precision requirements increase
Solution Approach 1:
The patent establishes a clear parameter relationship where distance H is larger than width W, creating a built-in geometric constraint that guides the connector tip to sink into the conductive adhesive. This parameter-based design provides manufacturing tolerance and reduces positioning precision requirements compared to exact-fit designs
Solution Approach 2:
The design inherently provides a cushioning effect by ensuring the connector tip extends beyond the connection base part in the thickness direction. This overhang allows the tip to sink into the conductive adhesive with some tolerance, compensating for manufacturing variations and reducing the need for high positioning precision
Data Source
AI summary
An electronic module comprises a sealing part 90, a rear surface-exposed conductor 10, 20, 30, a rear surface-unexposed conductor 40, 50 and a second connector 70 for electrically connecting an electronic element 15, 25 to the rear surface-unexposed conductor 40, 50. The rear surface-unexposed conductor 40, 50 is positioned on a front surface side compared with the rear surface-exposed part 12, 22, 32. The second connection tip part 72 is positioned on a rear surface side compared with the second connection base part 71. A distance H in a thickness direction between a rear surface side end part of the second connection base part 71 and a rear surface side end part of the second connection tip part 72 is larger than a width W of the second connection tip part 72 of the second connector 70.