Electronic Module Manufacturing Via Contact Opening Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing electronic modules face challenges in creating high-quality and reliable electrical connections within circuit boards, particularly in aligning components accurately and making contacts to components embedded inside the board, which can lead to reliability and yield issues.
Innovation Solution
The method involves manufacturing contact openings in the conductor layer at the positions of the component's contact areas, aligning the components using these openings, and forming electrical contacts through them, allowing for precise alignment and direct connection to the conductor layer on the circuit board surface, with options for additional conductor layers and improved conductive capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are embedded inside the circuit board during creation, then space utilization is improved and component cases can be eliminated, but manufacturing complexity increases and alignment precision becomes more difficult to achieve
Solution Approach 1:
The method performs preliminary actions by creating contact openings in the conductor layer before embedding the components. This allows precise positioning and alignment marks to be established in advance, making the subsequent component embedding process more manageable and precise, thereby reducing overall manufacturing complexity while achieving high space utilization.
Solution Approach 2:
The manufacturing process is segmented into distinct sequential steps: creating contact openings, forming alignment marks, embedding components, and establishing electrical connections. This segmentation allows each step to be optimized independently, reducing the overall manufacturing complexity while enabling precise component placement and high space utilization.
2Manufacturing precision
If contact openings are created in the conductor layer before component embedding, then alignment precision is improved, but manufacturing steps increase
Solution Approach 1:
Contact openings are created as a preliminary action before component embedding, establishing precise alignment references in advance. This preliminary structuring enables accurate component positioning without requiring additional complex alignment steps later in the process, thereby improving alignment precision while minimizing the increase in manufacturing steps.
3Reliability
If components are directly connected to the conductor layer on the circuit board surface, then electrical connection reliability is improved, but the risk of connection errors increases
Solution Approach 1:
Alignment marks are created as a preliminary action before establishing electrical connections. These marks serve as visual and physical guides that ensure components are accurately positioned over the contact openings, thereby maintaining high electrical connection reliability while preventing connection errors through improved visibility and positioning accuracy.
Solution Approach 2:
The alignment marks provide immediate visual feedback during the component embedding process, allowing operators to verify correct positioning before final connection establishment. This feedback mechanism ensures connection accuracy is maintained while achieving reliable electrical connections between components and the conductor layer.
Data Source
AI summary
Method for manufacturing an electronic module, which electronic module includes a component (6), which is connected electrically to a conductor-pattern layer (14). In the method contact openings (17) are made in the conductor layer (4), the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6). After this, the component (6) and the conductor layer (4) are aligned relative to each other, in such a way that the contact areas (7) of the component (6) come to the positions of the contact openings (17), and the component (6) is secured. After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made that connects the component (6) to the conductor layer (4). After the making of the contact the conductor layer (4) is patterned to form a conductor-pattern layer (14).