Electronic Module Thick-Film Layout for Faster Copper Structuring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic modules with thick copper substrates face challenges in cost-effectiveness and efficiency due to time-consuming etching processes and potential electric breakdowns from undercuts, especially for layers thicker than one millimeter.
Innovation Solution
The use of thermally conductive elements with a thickness of at least 0.5 millimeters, connected via a thermally conductive material like solder or adhesive, allowing for efficient heat dissipation and flexible structuring without undercuts, and produced using subtractive manufacturing methods like laser cutting or water jet cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thick copper substrates are structured by means of photostructurable paint or films during etching, then copper thicknesses of more than 2 millimeters can be achieved, but etching times increase to many minutes to hours and etching undercuts arise resulting in electric breakdowns
Solution Approach 1:
The thick copper substrate is segmented into multiple thinner copper layers, each separated by insulating material layers. This allows each layer to be etched independently and quickly without the time penalty of etching through the entire thickness, while maintaining the overall thick substrate structure for heat dissipation.
Solution Approach 2:
Insulating material layers are introduced as intermediaries between the copper layers. These intermediate layers prevent electrical breakdowns caused by etching undercuts, as they provide electrical isolation even when etching processes create undercut profiles in the copper conductors.
2Volume of moving object
If thick copper substrates are structured by means of photostructurable paint or films during etching, then copper thicknesses of more than 2 millimeters can be achieved, but etching undercuts arise resulting in electric breakdowns
Solution Approach 1:
Insulating material layers are introduced as intermediaries between the copper layers. These intermediate layers prevent electrical breakdowns caused by etching undercuts, as they provide electrical isolation even when etching processes create undercut profiles in the copper conductors.
3Productivity
If prestructuring is done by means of milling to speed up etching times, then etching undercuts are prevented, but production time is extended due to additional cleaning steps
Solution Approach 1:
The thick copper substrate is segmented into multiple thinner copper layers, each separated by insulating material layers. This allows each layer to be etched independently and quickly without the time penalty of etching through the entire thickness, while maintaining the overall thick substrate structure for heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of electronic modules with enhanced thermal conductivity and structural flexibility, reducing production time and costs while preventing electric breakdowns, and allows for easier adaptation to geometric requirements.
Implementation Method 1
thermally conductive material (70) are connected to one another, in particular by material bonding
Data Source
AI summary
Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.