Electronic Module Cover Panel Layout for Slim Device Integration
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Solution Overview
Problem
Electronic devices, particularly wearable devices, face challenges in accommodating multiple electronic modules within limited space while maintaining slimness and functionality, due to the need for compact and efficient module integration.
Innovation Solution
The electronic device design includes a first cover panel with a magnetic layer and conductive layer surrounding an opening, where the electronic module is positioned, and a cutting line is defined in these layers to create a space for the module, allowing it to be spaced apart and secured with adhesive layers, while the module overlaps only the magnetic and conductive layers in a plan view.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic modules are integrated into a compact space, then device functionality is improved, but device thickness increases
Solution Approach 1:
The patent transitions from a vertical stacking arrangement (which increases thickness) to a planar arrangement where electronic modules are positioned within openings in the cover panel, utilizing the horizontal dimension (length and width) instead. This allows multiple modules to be integrated without increasing device thickness, as they are distributed across the surface area rather than stacked vertically.
Solution Approach 2:
The cover panel is segmented into multiple openings, each accommodating a different electronic module. This segmentation allows independent placement of modules (fingerprint sensor, camera, speaker, etc.) within the planar structure, enabling functional versatility while maintaining a slim profile by avoiding vertical stacking.
2Area of stationary object
If electronic modules are positioned within openings in the cover panel, then space utilization is improved, but manufacturing complexity increases
Solution Approach 1:
The magnetic layer and conductive layer are merged into a single integrated structure with cutting lines formed in both layers simultaneously. This merging reduces the number of separate manufacturing steps and alignment operations required, thereby reducing manufacturing complexity while still achieving effective space utilization through the opening configuration.
Solution Approach 2:
The cutting lines are pre-formed in the magnetic and conductive layers during the panel manufacturing process, before the electronic modules are installed. This preliminary action simplifies subsequent assembly steps, as the openings are already prepared and modules can be directly positioned without requiring complex post-processing or alignment operations.
3Ease of operation
If cutting lines are formed in magnetic and conductive layers, then module spacing is improved, but structural integrity may be compromised
Solution Approach 1:
The cutting lines are positioned strategically to create openings for module placement while maintaining sufficient material continuity in critical areas. The magnetic and conductive layers retain their functional properties in the remaining portions, ensuring that structural integrity and electromagnetic shielding are preserved while still achieving proper module spacing and positioning.
Data Source
AI summary
An electronic device includes a display panel, a first cover panel disposed under the display panel, and an electronic module disposed under the display panel. The first cover panel includes a first adhesive layer disposed under the display panel, a cushion layer disposed under the first adhesive layer, a magnetic layer disposed under the cushion layer, and a conductive layer disposed under the magnetic layer. The first adhesive layer and the cushion layer together include an opening, and the electronic module is disposed within the opening. A cutting line is defined in the magnetic layer and the conductive layer, surrounding the opening.