Electronic Module Back-Surface Exposed Conductors Heat Dissipation
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Solution Overview
Problem
Electronic modules used in inverter or relay circuits face issues with heat dissipation efficiency and the risk of terminal parts slipping off or causing poor appearance due to burrs during resin sealing, especially with narrow-width components.
Innovation Solution
The design incorporates back-surface exposed and unexposed conductors with different terminal widths, where the unexposed parts are sealed within the sealing part, and the exposed parts have inward bends to prevent slipping and burr formation, enhancing heat dissipation and appearance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the entire back surface of the base end part is exposed from the sealing part to enhance heat dissipation, then heat dissipation efficiency is improved, but the base end part may slip off the sealing part and poor appearance may be caused by burr
Solution Approach 1:
The base end part is divided into two distinct regions: an exposed region for heat dissipation and a sealed region for structural support and connection. This segmentation allows the exposed back surface to dissipate heat effectively while the sealed portion maintains mechanical stability and prevents slipping off during assembly and operation.
2Temperature
If the entire back surface of the base end part is exposed from the sealing part to enhance heat dissipation, then heat dissipation efficiency is improved, but poor appearance may be caused by burr at the sealing part
Solution Approach 1:
The base end part is divided into an exposed region and a sealed region. The sealed region is positioned away from the peripheral surface of the sealing part, creating a clear separation that prevents burr formation at visible areas and maintains clean appearance while the exposed region provides effective heat dissipation.
3Strength
If the base end part having a narrow width is held when sealing with resin, then connection strength is improved, but it is difficult to prevent burr formation and poor appearance
Solution Approach 1:
The sealing part is designed with a structure that预先 (in advance) prevents burr formation by controlling the sealing process. The base end part is positioned such that the sealed region is away from the peripheral surface, and the sealing part's structure guides the resin flow to avoid excessive pressure on narrow-width portions, preventing burr formation while maintaining adequate connection strength.
Data Source
AI summary
An electronic module has a sealing part 90; electronic elements 15, 25 provided in the sealing part 90; back-surface exposed conductors 10, 20, 30 having back-surface exposed parts 12, 22, 32, which have back surfaces exposed from the sealing part 90, and having one-terminal parts 11, 21, 31, which extend from the back-surface exposed parts 12, 22, 32 and protrude outward from a side of the sealing part 90; and back-surface unexposed conductors 40, 50 having unexposed parts 42, 52, which are sealed in the sealing part 90, and having other-terminal parts 41, 51, which extend from the unexposed parts 42, 52 and protrude outward from a side of the sealing part 90. The electronic elements 15, 25 are placed on the back-surface exposed parts 12, 22, 32. The other-terminal parts 41, 51 have a width narrower than a width of the one-terminal parts 11, 21, 31.