Electronic Module Fixing on Perforated Plate for Card Fabrication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The integration of bulky electronic modules with variable shapes and dimensions into compact cards is challenging, particularly due to issues with precise positioning and maintaining electronic modules within the card manufacturing process, especially when manufacturing in batches.
Innovation Solution
A method involving an assembly where the electronic module is securely fixed to a perforated plate with projecting parts, allowing the module to be maintained in a precise position during the card manufacturing process, using filling material or resin to fill the spaces between the module and the plate, ensuring the module remains in place during resin application and solidification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the electronic module is placed in a through opening of a positioning frame without fixing means, then the manufacturing process is simple, but the electronic module undergoes displacement during card formation
Solution Approach 1:
The patent applies preliminary action by pre-assembling the electronic module with fixing means (adhesive strips or welding projections) before placing it in the through opening. This preliminary fixation ensures the module maintains its position during subsequent manufacturing steps, resolving the contradiction between simple placement and precise positioning.
Solution Approach 2:
The patent introduces an intermediary fixing means (adhesive strips on the module or welding projections) that mediates between the electronic module and the positioning frame. This intermediary element provides secure attachment while maintaining the simplicity of the through-opening structure, achieving both ease of manufacture and positioning precision.
2Manufacturing precision
If the dimensions of the through opening are reduced to match the electronic module dimensions, then positioning precision improves, but manufacturing tolerances cannot be accommodated
Solution Approach 1:
The patent applies local quality by providing fixing means (adhesive strips or welding projections) at specific locations on the electronic module rather than requiring the entire opening to be a tight fit. This localized fixation allows the opening to be larger than the module, accommodating tolerances while maintaining precise positioning through the localized attachment points.
Solution Approach 2:
The fixing means acts as an intermediary that decouples the dimensional relationship between the through opening and the electronic module. The adhesive strips or welding projections provide secure attachment even when there is a dimensional mismatch, allowing tolerance accommodation while maintaining positioning precision.
3Ease of operation
If electronic modules are manipulated freely during assembly, then the assembly process is flexible, but precautions and delicate handling are required
Solution Approach 1:
The patent applies preliminary action by pre-attaching fixing means to the electronic modules before assembly. This preliminary preparation eliminates the need for delicate handling during the assembly process, as the modules are already secured to the positioning frame, simplifying the overall operation while maintaining flexibility.
4Stability of the object's composition
If the electronic module is securely fixed to the plate, then positioning stability improves, but the module cannot be easily adjusted
Solution Approach 1:
The patent applies parameter changes by using adhesive strips with controllable adhesion properties or welding projections that can be selectively activated. The fixing means can be applied in a controlled manner during assembly, providing stability once fixed while allowing for adjustment during the assembly process before final fixation occurs.
Data Source
Figure 1~3B
Figure 4~6
Figure 7A~7B
AI summary
The assembly (22) involved in the fabrication of electronic cards comprises a plate (14) exhibiting a plurality of apertures (16) in which are respectively housed a plurality of electronic modules (2). These electronic modules are assembled to the plate 14 by fixing means, in particular by fixing bridges leaving a slot (26) over the major part of the surround of the electronic module. For example the fixing means are formed by projecting parts (18) at the periphery of the apertures (16), these projecting parts exhibiting a smaller thickness than the thickness of the plate (14) and serving as supports for the electronic modules, in particular for a substrate (12) of these modules. Fixing is performed for example by welding or adhesive bonding. The invention also relates to an intermediate product formed by such an assembly and a filling material that fills at least the major part of the remaining space in the apertures (16). The invention also relates to a method of fabricating cards in which the assembly according to the invention is finally coated in a resin to form substantially plane cards.