Electronic Device Module With Inclined Connection Conductors
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Solution Overview
Problem
Existing electronic device modules face challenges in miniaturization and protection of components due to the need for both surface mounting of electronic devices and formation of external terminals, while maintaining high performance and preventing electrical shorts and oxidation during manufacturing processes.
Innovation Solution
An electronic device module design featuring a board with external and mounting electrodes, a molded portion using epoxy molding compound, and connection conductors with inclined sections that penetrate through the molded portion to connect external terminals, along with an insulating layer that covers electrodes and connection conductors, facilitating efficient manufacturing and protection from oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If external terminals are formed directly on the board surface, then the module size can be reduced, but the external connecting electrodes are exposed to oxidation and environmental damage
Solution Approach 1:
The patent introduces a molded portion as an intermediary protective layer that covers the board and external connecting electrodes. This molded portion acts as a mediator between the external environment and the sensitive electrodes, preventing oxidation while allowing external terminals to be formed on its surface rather than directly on the board.
Solution Approach 2:
The molded portion is formed in advance before the external terminals are created. This preliminary action of encapsulating the board and electrodes provides a protective foundation that prevents oxidation exposure before the terminals are formed, ensuring reliability from the outset.
2Ease of manufacture
If connection conductors are made straight and uniform, then the manufacturing process is simpler, but the bonding surface area with external connecting electrodes is reduced
Solution Approach 1:
The connection conductors are designed with inclined sections rather than straight uniform shapes. This curvature/inclination increases the surface area of contact between the connection conductors and external connecting electrodes, enhancing bonding strength while remaining manufacturable through standard plating processes.
3Reliability
If the insulating layer completely covers the external connecting electrodes, then oxidation is prevented, but the connection conductors cannot bond to the electrodes
Solution Approach 1:
The insulating layer is selectively positioned to cover only specific portions of the external connecting electrodes. This local quality approach allows the insulating layer to provide oxidation protection where needed while leaving other areas exposed for conductor bonding, achieving both protection and manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the creation of compact, high-performance electronic device modules with reliable external terminal connections, preventing electrical shorts and oxidation, and simplifying the manufacturing process by using a double-sided molding structure with integrated connection conductors and external terminals.
Implementation Method 1
The forming of the via holes includes removing the molded portion and the insulating layer using a laser drill
Implementation Method 2
forming connection conductors by filling the via holes with conductive materials
Data Source
AI summary
An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.