Electronic Module With Lateral Electrodes for Parasitic Reduction
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Solution Overview
Problem
Conventional electronic module designs, such as Voltage Regulator Modules, face challenges in reducing parasitic effects and increasing efficiency due to complex circuit designs and large layout areas, making it difficult to minimize parasitic effects and enhance system efficiency.
Innovation Solution
The design incorporates a magnetic body with a coil and a substrate having electronic devices, where electrodes on the magnetic body and substrate are strategically positioned for electrical connection, allowing for a more compact layout and improved mechanical strength, enabling efficient power transfer and reduced parasitic effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If individual devices are assembled together or stacked devices are designed over one another, then the system can be constructed with separate components, but the total layout area becomes relatively large and circuit design becomes more complex
Solution Approach 1:
The patent combines the magnetic device and substrate into a single integrated package structure, where the magnetic device is disposed on the substrate and electrically connected through electrodes. This merging eliminates the need for separate assembly of individual devices, reducing the total layout area while maintaining component flexibility.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by disposing the magnetic device on the substrate surface and extending electrodes along lateral surfaces. This dimensional approach allows compact integration without increasing planar layout area, enabling vertical stacking and lateral connection optimization.
2Ease of operation
If conventional separate device assembly is used, then component placement is flexible, but parasitic effects increase and system efficiency decreases
Solution Approach 1:
By integrating the magnetic device directly on the substrate with embedded electrical connections, the patent minimizes the length of current paths and reduces parasitic inductance and resistance. The electrodes extend along lateral surfaces to provide direct electrical connection between components, reducing energy loss.
Solution Approach 2:
The substrate acts as an intermediary structure that provides both mechanical support and electrical connection pathways. The electrodes embedded in or extending from the substrate serve as intermediaries for current flow, reducing parasitic effects compared to traditional wire connections while maintaining placement flexibility.
3Ease of manufacture
If devices are placed outside line zones to avoid fixed holes, then routing constraints are satisfied, but the layout area increases and circuit design complexity increases
Solution Approach 1:
The patent resolves routing constraints by utilizing lateral surfaces and three-dimensional electrode arrangements instead of being constrained to planar routing. Electrons can travel through the substrate thickness and along lateral surfaces, providing multiple dimensional pathways for current flow that satisfy routing requirements without increasing layout area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a more efficient and compact electronic module with reduced parasitic effects, enhancing system efficiency and allowing for smaller layout areas, while maintaining compatibility with existing SMT manufacturing processes.
Implementation Method 1
a coil is disposed in the magnetic body, wherein the coil is electrically connected to a power device on the substrate through the first electrode of the magnetic device such that said power device is capable of providing power to the second substrate through the coil
Data Source
AI summary
An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.