Electronic Module Thermal Coupling via Metal Spacer
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Solution Overview
Problem
Handheld power tool electronics modules face challenges in decoupling printed circuit boards from housing components regarding movement, temperature, and current flow, leading to inefficient cooling and potential mechanical stress.
Innovation Solution
The implementation of a metal spacer that creates a thermal coupling between the semiconductor and the printed circuit board, allowing for indirect temperature measurement and a structurally simple mounting of the printed circuit board relative to the cooling device, which is designed as a housing component, ensuring effective cooling and robust control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the printed circuit board is decoupled from the housing component using encapsulation compound, then movement and current flow are isolated, but thermal coupling is insufficient leading to inefficient cooling
Solution Approach 1:
The patent divides the isolation function into two separate components: an encapsulation compound for mechanical and electrical isolation, and a metal spacer for thermal management. This segmentation allows each component to specialize in one function, resolving the contradiction between mechanical isolation and cooling efficiency.
Solution Approach 2:
The metal spacer acts as an intermediary element between the printed circuit board and cooling device. It provides thermal coupling to improve cooling efficiency while the encapsulation compound maintains mechanical isolation, thus resolving the contradiction through a mediating component.
2Device complexity
If a spacer is used to space the printed circuit board from the cooling device, then structural simplicity is achieved, but thermal coupling between semiconductor and printed circuit board is reduced
Solution Approach 1:
The patent segments the thermal management function into two parts: the metal spacer provides structural support and spacing, while a separate thermal coupling element (such as thermal paste or a thermally conductive interface) ensures efficient heat transfer between the semiconductor and printed circuit board. This segmentation resolves the contradiction between structural simplicity and thermal coupling.
3Temperature
If the semiconductor is arranged directly on the cooling device, then cooling efficiency is improved, but positioning and fastening complexity increases
Solution Approach 1:
The metal spacer serves multiple functions simultaneously: it provides mechanical support, maintains spacing, enables thermal coupling, and facilitates positioning and fastening of the semiconductor on the cooling device. This multi-functionality resolves the contradiction by consolidating multiple requirements into a single component.
4Device complexity
If indirect temperature measurement is implemented through thermal coupling, then component count is reduced, but measurement precision may be affected
Solution Approach 1:
The metal spacer serves as a thermal intermediary that conducts heat from the semiconductor to the printed circuit board where the temperature sensor is located. This thermal coupling allows indirect measurement while maintaining sufficient precision for the application, resolving the contradiction between reduced component count and measurement accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact design with optimal cooling, reliable operation, and cost-effective assembly by allowing for precise positioning and secure fastening of components, while indirectly measuring semiconductor temperature, thus enhancing the mechanical stress-free mounting and cooling efficiency.
Implementation Method 1
the at least one spacer creates a thermal coupling between at least the at least one semiconductor and the at least one printed circuit board
Implementation Method 2
with at least one cooling device, which is at least forms a housing component
Data Source
AI summary
The invention relates to an electronic module, particularly for a portable power tool (12), having an electronic module housing (14) and having at least one printed circuit board (16). The invention provides that the at least one printed circuit board (16) is at least partially decoupled relative to at least one housing component (18) of the electronic module housing (14).