Electronic Module Sensor Positioning via PCB Through-Hole
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Solution Overview
Problem
Existing electronic modules in automotive transmissions face challenges in protecting electronic components from aggressive transmission fluids and managing the installation and positioning of sensor elements, which can be prone to mechanical stress and thermal expansion issues.
Innovation Solution
The electronic module design features a circuit board with a potting compound covering electronic components, including a socket for screwable connections that allows for flexible sensor element positioning without mechanical stress, using a thermoset material for the potting compound to ensure stability and protection from transmission fluids, and embedding electrical connections within the compound for added protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sensor element is installed in a plastic carrier with mechanical preload, then the sensor position is fixed, but the assembly becomes complex and cannot be changed without complex modification
Solution Approach 1:
The sensor element is extracted from the plastic carrier and directly mounted on the PCB. The through-hole in the PCB provides direct access to the sensor element, eliminating the need for the plastic carrier and its associated mechanical preload system. This simplifies the assembly while maintaining sensor position stability through the potting compound that secures the sensor in place.
Solution Approach 2:
The mounting function previously performed by the plastic carrier is merged into the PCB structure itself. The through-hole in the PCB combined with the potting compound creates an integrated mounting solution that both positions and secures the sensor element, eliminating the need for separate carrier components.
2Ease of manufacture
If the circuit board is subjected to mechanical stress from sensor installation, then the sensor can be mounted, but the circuit board may be damaged
Solution Approach 1:
The potting compound is applied beforehand to secure the sensor element in the through-hole, creating a cushioning effect that prevents mechanical stress from being transmitted to the PCB during operation. The compound absorbs hydraulic pressure and prevents force transmission to the circuit board.
Solution Approach 2:
The potting compound acts as an intermediary between the sensor element and the PCB. It provides the necessary mechanical support and stress absorption, preventing direct force transmission from the sensor to the circuit board while still allowing secure mounting.
3Ease of operation
If transmission fluid is exposed to electronic components, then the components are accessible, but the components are damaged by aggressive fluid
Solution Approach 1:
The electronic components and sensor element are nested within the potting compound, which is itself mounted on the PCB. This nested structure provides multiple layers of protection, with the potting compound serving as a barrier that prevents transmission fluid from reaching and damaging the electronic components while allowing the sensor to remain accessible through the through-hole.
4Adaptability or versatility
If different materials are used for carrier and circuit board, then mounting is possible, but thermal expansion differences cause problems
Solution Approach 1:
The potting compound is selected to have thermal expansion properties that are homogeneous with or compatible to those of the PCB. This eliminates the thermal expansion mismatch problems that would occur between dissimilar materials like plastic carriers and PCBs, ensuring stability across temperature variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables easy adaptation of sensor element positioning, eliminates mechanical stress, and provides effective protection against transmission fluids and thermal expansion, ensuring reliable operation under hydraulic pressure without the need for additional carriers or fasteners.
Implementation Method 1
a potting compound arranged on the first side which covers the electronic components
Implementation Method 2
using a thermoset material for the potting compound to ensure stability and protection from transmission fluids
Implementation Method 3
the medium channel being in fluid communication with the sensor element
Data Source
Figure 1
Figure 2~4
Figure 5~6
AI summary
The application relates to an electronic module (1), more particularly a control module or sensor module for a motor vehicle transmission, having a circuit board (2) having a first side (21) and a second side (22) facing away from the first side (21), electronic components (24) arranged on the first side (21) and a casting compound (8) arranged on the first side (21), which casting compound (8) covers the electronic components (24). It is proposed that the circuit board (2) has a through-hole connecting the first side (21) to the second side (22) and that a sensor element (4) covering the through-hole (23) is arranged on the first side (21) of the circuit board (2). The application also relates to a combination of an electronic control module of this kind and a hydraulic plate, wherein the second side (22) of the circuit board (2) of the electronic control module (1) lies flat on a surface (31) of the hydraulic plate (3) and the hydraulic plate (3) has a medium channel (33) which opens at the surface (31), wherein the medium channel (33) is fluidically connected to the sensor element (4).