Electronic Module Spacing Element for Thermal Stress Reduction
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Solution Overview
Problem
Electronic modules used in high-power applications, such as electric vehicles, face challenges with heat dissipation and mechanical stress due to temperature changes, leading to potential failure and delamination issues.
Innovation Solution
An electronic module design that includes a spacing element with a coefficient of thermal expansion matched to the first and second carriers and the mold compound, reducing mechanical stress and delamination by ensuring the thermal expansion values of all components are closely aligned, typically within ±6 ppm/K, and using conductive materials for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are provided on both main surfaces of the power module to improve heat dissipation, then thermal management is improved, but the complexity of the device structure increases
Solution Approach 1:
The spacing element serves multiple functions simultaneously: it provides thermal conduction path from the semiconductor chip, maintains mechanical spacing between components, and acts as a structural support element. This multi-functionality eliminates the need for separate heat dissipation structures, reducing overall device complexity while maintaining effective thermal management.
2Temperature
If materials with high thermal conductivity are used for substrates and lead frames to improve heat dissipation, then thermal management is improved, but the coefficient of thermal expansion mismatch increases leading to higher mechanical stress
Solution Approach 1:
The spacing element is designed with specific material parameters including controlled thermal conductivity and matched coefficient of thermal expansion. By carefully selecting and adjusting these parameters, the element achieves both effective thermal conduction and compatibility with surrounding components, reducing thermomechanical stress during temperature cycling while maintaining heat dissipation performance.
Solution Approach 2:
The spacing element may be constructed from composite materials that combine different properties - such as metal matrices with ceramic particles or fibers - to achieve both high thermal conductivity and tailored coefficient of thermal expansion. This allows optimization of both heat dissipation and stress compatibility simultaneously.
3Temperature
If the spacing element has high thermal conductivity to improve heat dissipation, then thermal management is improved, but the material selection becomes more restricted due to CTE matching requirements
Solution Approach 1:
The spacing element is designed with specific material parameters including controlled thermal conductivity and matched coefficient of thermal expansion. By carefully selecting and adjusting these parameters, the element achieves both effective thermal conduction and compatibility with surrounding components, reducing thermomechanical stress during temperature cycling while maintaining heat dissipation performance.
Solution Approach 2:
The spacing element may be constructed from composite materials that combine different properties - such as metal matrices with ceramic particles or fibers - to achieve both high thermal conductivity and tailored coefficient of thermal expansion. This allows optimization of both heat dissipation and stress compatibility simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the longevity and reliability of electronic modules by minimizing mechanical stress and preventing delamination, allowing them to withstand multiple temperature cycles without failure, thus improving their operational lifespan and reducing electrical path disruptions.
Implementation Method 1
a spacing element arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component
Implementation Method 2
the spacing element comprises a material having a coefficient of thermal expansion value being matched with at least one coefficient of thermal expansions selected out of the group of coefficients of thermal expansion consisting of: a coefficient of thermal expansions of the first carrier; a coefficient of thermal expansions of the second carrier; a coefficient of thermal expansions of the electronic chip; and a coefficient of thermal expansions of the mold compound
Data Source
AI summary
An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.