Electronic Module With Segmented TX/RX Interference Shielding
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Solution Overview
Problem
In compact wireless communication equipment, undesirable interference occurs between transmitting and receiving parts due to their close proximity, which is not effectively addressed by existing duplexing devices.
Innovation Solution
An electronic module design with physically separated transmitting and receiving parts, isolated by a shielding structure, and connected through a substrate, which includes a duplexing device to prevent electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If transmitting and receiving parts are disposed in close proximity to reduce package size, then device compactness is improved, but electromagnetic interference between TX and RX increases
Solution Approach 1:
The circuit board is divided into a first circuit board for the transmitting part and a second circuit board for the receiving part, physically separating the two functional areas while maintaining a compact overall structure. This segmentation reduces electromagnetic interference between TX and RX by isolating their respective signal paths and grounding systems.
Solution Approach 2:
A grounding structure serves as an intermediary element between the transmitting and receiving parts. The grounding structure includes a first grounding area on the first circuit board and a second grounding area on the second circuit board, connected through a grounding via. This intermediary grounding system provides a low-impedance path for interference currents, effectively shielding the receiving part from transmitting part interference while maintaining compact dimensions.
2Object-affected harmful factors
If physically separated transmitting and receiving parts are used to reduce interference, then electromagnetic isolation is improved, but device complexity increases
Solution Approach 1:
The grounding structure merges the grounding requirements of both the transmitting part and receiving part into a unified system. The first grounding area, second grounding area, and grounding via form an integrated grounding network that simultaneously serves both circuit boards, reducing the need for separate shielding structures and simplifying the overall design while maintaining effective electromagnetic isolation.
Solution Approach 2:
The grounding structure acts as a thin-film-like electromagnetic shield between the transmitting and receiving parts. The grounding via connects the two grounding areas through a minimal thickness path, providing effective electromagnetic shielding without requiring bulky shielding enclosures or complex multi-layer structures, thus maintaining design simplicity.
3Productivity
If compact design with close proximity of TX and RX is implemented, then integration density is improved, but signal quality deteriorates due to self-interference
Solution Approach 1:
The circuit system is segmented into distinct first and second circuit boards, each dedicated to either transmitting or receiving functions. This physical segmentation allows high integration density within each board while preventing signal quality degradation through cross-board electromagnetic isolation, enabling both compactness and high signal integrity simultaneously.
Solution Approach 2:
The grounding structure serves as an intermediary shield that maintains signal quality in the compact design. By providing a low-impedance reference plane and interference path between the closely spaced transmitting and receiving circuit boards, the grounding via structure ensures that self-interference does not degrade signal quality, enabling high integration density without compromising communication reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances isolation between transmitting and receiving parts, alleviating self-interference and reducing package size while maintaining low insertion loss and cost efficiency.
Implementation Method 1
an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part
Data Source
AI summary
The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.