Electronic Component Molded Body Thermal Protection

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Solution Overview

Problem

The insert molding process for electronic components often results in thermal deterioration and package deformation due to the application of heat and pressure, compromising the operational stability of the incorporated electronic components.

Innovation Solution

A molded body is created using a two-stage molding process with a first resin forming a cavity in the first film and a second resin surrounding the electronic component, which is mounted on a second film, allowing for controlled illumination and concealment of the component, using resins with specific optical properties to manage light transmission and reflection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If insert molding process is used to incorporate electronic components, then electronic functions can be integrated into the molded body, but thermal deterioration and package deformation occur due to heat and pressure application

Engineering Contradiction:

Improveelectronic function integrationVSAvoidoperational stability of electronic components

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The molded body is divided into multiple layers: a first molded body containing the electronic component, and a second molded body covering the first molded body. This segmentation allows the electronic component to be protected from thermal and mechanical stress during the molding process while still achieving functional integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The electronic component is mounted on a film and sealed within the first molded body before the second molding step. This preliminary encapsulation protects the component from heat and pressure during the subsequent molding process, preventing thermal deterioration and package deformation.

Inventive Principle:

Principle #10Preliminary action

2Adaptability or versatility

If electronic components are exposed during molding, then functional integration is achieved, but the components are vulnerable to heat and pressure damage

Engineering Contradiction:

Improvefunctional integrationVSAvoidheat and pressure damage

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The electronic component is beforehand enclosed in a protective first molded body that acts as a cushion against heat and pressure. This preliminary protection structure prevents harmful factors from directly affecting the component during the molding process.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The first molded body serves as an intermediary structure between the electronic component and the molding environment. It mediates the interaction by absorbing and distributing heat and pressure, preventing direct damage to the component while allowing functional integration.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If a single-layer molded body is used, then manufacturing is simpler, but thermal protection of electronic components is insufficient

Engineering Contradiction:

Improvemolding process simplicityVSAvoidthermal deterioration

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The manufacturing process is segmented into two sequential molding steps: first molding the protective body with the electronic component, then molding the covering body. This segmentation provides enhanced thermal protection while maintaining manufacturing simplicity through standardized sequential processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The molded body uses composite structure with different material properties: the first molded body uses material optimized for thermal protection and component encapsulation, while the second molded body uses material optimized for external protection and aesthetics. This composite approach addresses thermal deterioration while maintaining ease of manufacture.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS11507229B2Molded body for electronic function, method for manufacturing the same, and operation device using molded body for electronic function

Publication Date: 2022.11.22 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A molded body for an electronic function includes a first film in which one surface thereof constitutes an external appearance surface, a second film in which an electronic component is mounted on a surface thereof facing a surface of the first film opposite to the external appearance surface, and a first resin that fills a space between the first film and the second film. The first resin has a cavity, and the cavity is filled with a second resin, and the electronic component is disposed in the cavity and surrounded by the second resin.