Electronic Package Mounting via Elastic Clip Mechanism

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Solution Overview

Problem

Existing electronic devices with position detecting sensors, such as those used in fluid pressure cylinders, face increased production costs and potential detection errors due to soldering and resin-based mounting methods, which are time-consuming and can apply stress to magnetic sensors, especially in high-temperature environments.

Innovation Solution

An electronic device design featuring a support body with metal projections and a clip member made of an elastic metal plate that securely clamps the electronic package without soldering, allowing for easy assembly and reduced stress on the sensor circuitry, using a method where the clip member is mounted perpendicular to the support body to press metal projections against receiving portions, ensuring stable mounting without direct compressive force on the package.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If soldering is used to mount the reed switch on the board, then the mounting strength is improved, but the production time and cost increase

Engineering Contradiction:

Improvemounting strengthVSAvoidproduction time

Core Design Contradiction:

StrengthVSLoss of time

Solution Approach 1:

The patent replaces the soldering process (thermal/mechanical system) with a mechanical clipping system. The clip member with elastic piece provides mounting strength through elastic deformation and mechanical interlocking, eliminating the need for soldering while reducing production time and complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Strength

If resin material is used to fix the magnetic sensor onto the board, then the mounting strength is improved, but the production time and cost increase due to additional steps

Engineering Contradiction:

Improvemounting strengthVSAvoidproduction process complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent replaces the resin-based mounting system (requiring application and curing steps) with a pure mechanical clipping system. The clip member provides both mounting strength and positioning in a single operation, eliminating multiple production steps and reducing complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If resin material is used to secure the magnetic sensor, then the mounting strength is improved, but detection errors increase due to stress on the sensor circuitry

Engineering Contradiction:

Improvemounting strengthVSAvoiddetection accuracy

Core Design Contradiction:

StrengthVSMeasurement precision

Solution Approach 1:

The patent replaces resin-based mounting with a mechanical clip system that distributes mounting forces through the package housing rather than directly on the sensor body. This eliminates stress-induced detection errors while maintaining secure mounting through the elastic piece and pressing portions.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Strength

If soldering is used in high-temperature environments, then the mounting strength is improved, but the reliability decreases due to thermal damage

Engineering Contradiction:

Improvemounting strengthVSAvoidsensor reliability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent replaces soldering (thermal process) with a purely mechanical clipping system that operates without heat. The elastic piece provides continuous mounting strength through mechanical deformation, ensuring reliability in high-temperature environments where soldering would cause thermal damage or degradation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces production time and costs, minimizes stress on the sensor circuitry, and maintains reliability even in high-temperature environments by eliminating soldering and resin application, thereby preventing detection errors and ensuring stable sensor operation.

Implementation Method 1

a clip member formed of an elastic metal plate... elastically pressing the elastic piece against a rear side of the support body so as to cause the pressing portion to press the metal projections against the projection receiving portions

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS10251295B2Electronic device and method of producing the same

Publication Date: 2019.04.02 ALPS ALPINE CO LTD

AI summary

A first main body portion and a second main body portion of an electronic package are mounted on a mount portion of a support body, first metal projections are caused to enter first receiving recesses, and second metal projections are caused to enter second receiving recesses. When a clip member is mounted in the a first direction, the first metal projections are pressed by first pressing portions of the clip member, the second metal projections are pressed by second pressing portions of the clip member, and an elastic piece is pressed against a rear side of the support body. Thus, the electronic package is secured.