Electronic Package Structure to Prevent Conductive Column Tilting
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Solution Overview
Problem
Conventional semiconductor packaging methods face issues with conductive columns being tilted or broken due to encapsulant impact, leading to ineffective electrical connections between the circuit and routing structures.
Innovation Solution
A manufacturing method involving a first packaging layer covering a conductive column with a portion protruding, which is then covered by a second packaging layer, allowing the conductive column to be integrally formed and reducing impact from the second layer, ensuring effective alignment and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conductive columns are formed by electroplating on the circuit structure and then covered with encapsulant, then the manufacturing process can be completed, but the conductive columns are easily impacted by the encapsulant to be tilted or broken
Solution Approach 1:
The patent divides the packaging process into two separate stages: first forming the conductive columns, then forming the encapsulant. This segmentation allows the conductive columns to be established before the encapsulant is applied, preventing the encapsulant from impacting and tilting the columns during the packaging process.
Solution Approach 2:
The conductive columns are formed in advance before the encapsulant is applied. This preliminary action ensures that the columns are already in place and can serve as alignment references for subsequent routing structure formation, preventing tilting and breaking issues.
2Ease of manufacture
If conductive columns are covered completely by encapsulant, then the packaging is complete, but the conductive columns cannot be effectively aligned for routing structure formation
Solution Approach 1:
The encapsulant is designed to cover only specific regions while leaving the conductive columns exposed. This local quality approach allows the encapsulant to protect certain areas while maintaining the visibility and accessibility of the conductive columns for precise alignment during routing structure formation.
3Productivity
If conductive columns are tilted or broken, then the packaging process continues, but the electrical connection between circuit structure and routing structure becomes ineffective
Solution Approach 1:
The patent implements protective measures beforehand by forming the encapsulant in a controlled manner that does not impact the conductive columns. This prior cushioning prevents the columns from being tilted or broken during the packaging process, ensuring their integrity and the effectiveness of the electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the reliability of electrical connections by preventing conductive column tilting or breaking, allowing for effective alignment and improved electrical connectivity between circuit and routing structures.
Implementation Method 1
the conductive column is electrically connected to the circuit structure
Data Source
AI summary
An electronic package is provided, in which a first packaging layer is formed on a circuit structure, a portion of at least one conductive column is inserted into the first packaging layer, a remaining portion of the conductive column is protruded from the first packaging layer, and a second packaging layer is formed to cover the remaining portion of the conductive column, so that the conductive column is integrally formed in the first packaging layer and the second packaging layer. Therefore, the impact on the conductive column from the second packaging layer can be reduced and the problem of tilting of the conductive column can be prevented.