Electronic Package Reinforcement for Dielectric Crack Prevention
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Solution Overview
Problem
Conventional electronic packages face issues with dielectric layers cracking under pressure from electronic structures, leading to poor process yield due to insufficient support from the circuit layer.
Innovation Solution
Incorporating a reinforced insulation portion with higher hardness and modulus than the dielectric layer, positioned between the dielectric layer and conductive structures, to provide support and prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the dielectric layer is used to support electronic structures directly, then the structure is simple, but the dielectric layer cracks under pressure leading to poor process yield
Solution Approach 1:
A reinforced insulation portion is introduced as an intermediary component between the dielectric layer and the electronic structures. This mediator has higher hardness and mechanical strength than the dielectric layer, enabling it to bear the pressure from electronic structures without cracking, while the dielectric layer maintains its original function of electrical insulation without bearing excessive mechanical load.
Solution Approach 2:
The patent employs composite material construction by combining the dielectric layer with the reinforced insulation portion to form a layered support structure. The reinforced insulation portion is made of materials with superior mechanical properties (higher hardness and modulus) compared to the dielectric layer, creating a composite system that leverages the strengths of each material for both structural support and electrical insulation.
2Ease of manufacture
If the dielectric layer supports electronic structures directly, then the manufacturing process is simple, but cracking occurs under pressure reducing process yield
Solution Approach 1:
The reinforced insulation portion serves as a mediator layer that simplifies the manufacturing process by providing a dedicated pressure-bearing component. This separation of functions (dielectric layer for insulation, reinforced insulation for mechanical support) makes the manufacturing process more robust and less prone to defects, thereby improving process yield despite the additional layer.
Solution Approach 2:
The support function is segmented from the dielectric layer and assigned to a separate reinforced insulation portion. This segmentation allows each layer to be optimized for its specific function - the dielectric layer for electrical insulation and the reinforced insulation portion for mechanical support - resulting in improved overall reliability and process yield.
3Reliability
If a reinforced insulation portion with higher hardness is added, then cracking is prevented, but the device complexity increases
Solution Approach 1:
The reinforced insulation portion is strategically positioned only in areas where electronic structures are disposed, providing localized reinforcement exactly where pressure and cracking risk are highest. This local quality approach prevents cracking in critical areas without unnecessarily increasing the complexity of the entire device structure.
Solution Approach 2:
The reinforced insulation portion acts as a specialized intermediary layer that resolves the contradiction between reliability and complexity. By introducing this single mediator component with higher hardness, the patent achieves crack prevention without requiring complex structural modifications throughout the entire device.
Data Source
AI summary
An electronic package is provided, in which a conductive structure and a reinforced insulation portion are bonded to a dielectric layer, and the reinforced insulation portion is in contact with and abuts against the conductive structure, such that the reinforced insulation portion can support the conductive structure to prevent the conductive structure from cracking when an electronic structure is disposed on the dielectric layer and electrically connected to the conductive structure.