Electronic Package Heat Dissipation Assembly to Prevent Delamination
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Solution Overview
Problem
Conventional semiconductor packaging methods face issues with uneven stress distribution and delamination due to the mismatch in thermal expansion coefficients between thermal interface materials and adhesives, leading to decreased thermal conductivity and product reliability.
Innovation Solution
A method where the heat dissipation material is cured first, followed by forming and curing a bonding layer, allowing the heat dissipation structure to be effectively fixed, thereby avoiding delamination and improving stress distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the TIM layer and adhesive layer are thermally solidified by a single baking operation, then the manufacturing process is simple, but the stress distribution becomes uneven due to CTE mismatch, causing delamination and warpage
Solution Approach 1:
The patent divides the single baking operation into two separate heating operations: a first heating operation to cure the TIM layer, and a second heating operation to cure the adhesive layer. This segmentation allows each layer to be cured independently under optimized conditions, preventing stress concentration and delamination while maintaining manufacturing simplicity.
Solution Approach 2:
The patent performs the first heating operation to cure the TIM layer before forming and curing the adhesive layer in the second heating operation. This preliminary action ensures the TIM layer is fully solidified and stable before the adhesive layer is applied and cured, preventing stress-induced delamination between layers.
2Ease of manufacture
If the heat dissipation structure is bonded directly to the semiconductor chip with poor heat transfer encapsulant, then the assembly is simple, but the heat dissipation efficiency is insufficient due to poor thermal conductivity
Solution Approach 1:
The patent employs a composite heat dissipation structure consisting of a heat dissipation material layer with high thermal conductivity bonded to the semiconductor chip, and a heat dissipation structure (heat sink) with supporting legs. This composite structure combines materials with different properties to achieve both effective heat conduction from the chip and efficient heat dissipation to the environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat conduction and product reliability by ensuring the heat dissipation structure is securely attached, reducing warpage and maintaining thermal conductivity.
Implementation Method 1
the heat generated by the semiconductor chip is conducted to the heat sink 13 via the inactive surface 11b and the TIM layer 12
Implementation Method 2
performing a first heating operation to cure the heat dissipation material to complete an arrangement of the heat dissipation material
Implementation Method 3
performing a second heating operation to cure the bonding layer to complete an arrangement of the bonding layer
Data Source
AI summary
A method of manufacturing an electronic package is provided, in which an electronic element is disposed on a carrier structure; a heat dissipation body of a heat dissipation structure is disposed on the electronic element via a heat dissipation material; the heat dissipation material is cured; supporting legs of the heat dissipation structure are fixed on the carrier structure via a bonding layer; and the bonding layer is cured. Therefore, the heat dissipation structure can be effectively fixed to the heat dissipation material and the bonding layer by completing the arrangements of the heat dissipation material and the bonding layer in stages.