Electronic Package Thickness Reduction via Direct Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional package stack structures face challenges in miniaturization due to the thickness limitations imposed by the organic upper packaging substrate and supporting solder balls, which hinder the reduction of overall package thickness below 240 um.
Innovation Solution
The solution involves an electronic package structure that eliminates the conventional upper packaging substrate and supporting solder balls by using a carrier with conductors formed within the electronic component to connect the carrier and an electronic device, where the conductors are partially exposed from an encapsulant, allowing for reduced thickness and simplified fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an organic upper packaging substrate with thickness d of 150 to 800 um is used, then the structural integrity and support function are improved, but the overall thickness D of the package stack structure increases and cannot be reduced below 240 um
Solution Approach 1:
The patent removes the traditional organic upper packaging substrate from the package structure. Instead of using a separate substrate layer, the invention directly bonds the electronic component to the lower packaging substrate, extracting the substrate function and replacing it with a simplified structure that eliminates the thickness constraint of 150-800 um organic substrates.
Solution Approach 2:
The invention inverts the conventional packaging approach by eliminating the upper substrate and using the electronic component itself as the structural element. The component's own packaging structure serves dual purposes: both housing the electronic element and providing the structural support that traditionally required a separate organic substrate.
2Reliability
If supporting solder balls with height R greater than semiconductor element height r are used, then the semiconductor element is protected from impacting the upper packaging substrate, but the overall thickness D is limited and cannot be reduced below 240 um
Solution Approach 1:
The patent removes the supporting solder balls from the package structure. The protection function previously provided by the solder balls is replaced by direct bonding of the electronic component to the lower packaging substrate, eliminating the need for intermediate supporting elements and reducing overall thickness.
Solution Approach 2:
The invention merges the functions of the supporting solder balls and the upper packaging substrate into a single integrated structure. The electronic component directly bonds to the lower substrate, combining the support function and the packaging function into one continuous structure, thereby eliminating the thickness contribution of separate supporting elements.
3Strength
If conventional upper packaging substrate and supporting solder balls are used, then structural support and element protection are achieved, but material cost increases and fabrication process becomes complex
Solution Approach 1:
The patent extracts and removes two separate components (upper packaging substrate and supporting solder balls) from the conventional package structure, replacing them with a simplified direct-bond configuration. This reduction in component count directly simplifies the fabrication process and reduces material costs while maintaining structural support functionality.
Solution Approach 2:
The invention segments the packaging function from the structural support function, allowing the lower packaging substrate to perform both roles simultaneously. This functional segmentation eliminates the need for multiple separate components and their associated assembly steps, thereby reducing fabrication complexity.
Data Source
AI summary
An electronic package and a method for fabricating the same are provided. The method includes disposing on a carrier an electronic component having a plurality of conductors, encapsulating the electronic component with an encapsulant, and disposing an electronic device on the encapsulant. The electronic device and the carrier are electrically connected through the conductors, thereby reducing the overall thickness of the electronic package.