Electronic Package With Dual Plating Layers For Heat Dissipation
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Solution Overview
Problem
Existing electronic component packages face limitations in size reduction due to insufficient heat dissipation and reliability, especially when used in high-voltage and high-current applications, leading to potential malfunction and damage from heat stress.
Innovation Solution
An electronic component package design featuring a sealing resin layer with a metal member having a first plating layer with a smaller average crystal grain diameter and a second plating layer with a larger average crystal grain diameter, buried within the resin, along with a ceramic substrate that is partially overlapped with the metal member, enhancing heat dissipation and reducing package size through efficient thermal conductivity and creepage distance management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package size is reduced, then the integration density increases, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent employs a composite structure combining ceramic substrate (high thermal conductivity) with metal member plating layers. The ceramic substrate provides excellent heat dissipation pathways, while the metal plating layers on the die bond portion and terminal electrode portions enhance thermal conduction at critical interfaces, enabling effective heat management in a compact package volume.
Solution Approach 2:
The patent applies different plating layer configurations to different regions of the metal member. The die bond portion has a first plating layer with specific crystal grain characteristics optimized for thermal conduction to the ceramic substrate, while the terminal electrode portion has a second plating layer with different crystal grain characteristics optimized for both electrical connection and heat dissipation to external terminals.
2Volume of moving object
If the package size is reduced, then the integration density increases, but the reliability under heat stress deteriorates
Solution Approach 1:
The combination of ceramic substrate and metal member with dual plating layers creates a thermally robust composite structure. The ceramic material inherently withstands high temperatures, while the metal plating layers provide stable thermal pathways, collectively enhancing reliability under heat stress conditions despite the reduced package size.
Solution Approach 2:
By optimizing the plating layer crystal grain structures at specific locations (die bond portion and terminal electrode portions), the patent ensures that critical thermal and electrical interfaces maintain high reliability under heat stress, compensating for the overall size reduction.
3Reliability
If the plating layer crystal grain diameter is increased, then the electrical conductivity improves, but the adhesion strength to ceramic substrate deteriorates
Solution Approach 1:
The patent applies different plating layer configurations to different regions: the first plating layer at the die bond portion has crystal grain characteristics optimized for adhesion to the ceramic substrate, while the second plating layer at the terminal electrode portion has crystal grain characteristics optimized for electrical conductivity to external terminals.
Solution Approach 2:
The metal member is divided into functionally distinct plating layers: the first plating layer interfaces with the ceramic substrate for mechanical bonding and thermal conduction, while the second plating layer provides electrical connection to external terminals. This segmentation allows each layer to be optimized for its specific function without compromising the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved heat dissipation and reliability by efficiently transmitting heat through the ceramic substrates with high thermal conductivity, reducing the package size while maintaining high-voltage creepage distance security and minimizing inductance caused by wire lengths.
Implementation Method 1
The metal member includes a first plating layer and a second plating layer, and an average crystal grain diameter of the first plating layer is smaller than an average crystal grain diameter of the second plating layer
Implementation Method 2
efficiently transmitting heat through the ceramic substrates with high thermal conductivity
Data Source
AI summary
An electronic component package includes: a sealing resin layer; a metal member buried therein and including a die bond portion and a terminal electrode portion located outside the die bond portion; a ceramic substrate buried in the sealing resin layer; and an electronic component disposed on the die bond portion. When viewed in plan, the die bond portion and the ceramic substrate are partially overlapped to be in contact with each other, and the terminal electrode portion and the ceramic substrate are partially overlapped to be in contact with each other. The electronic component is electrically connected to the terminal electrode portion. The metal member includes a first plating layer and a second plating layer, and the average crystal grain diameter of the first plating layer is smaller than the average crystal grain diameter of the second plating layer.