Electronic Package Shielding Structure for Strong EMI Protection
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Solution Overview
Problem
Conventional semiconductor packages with a single metal shielding layer are inadequate in preventing electromagnetic interference (EMI), especially when faced with strong external electromagnetic waves or low-frequency semiconductor elements, leading to signal transmission errors.
Innovation Solution
The electronic package incorporates a shielding structure comprising multiple metal layers, including chromium and nickel layers, positioned between the shielding layer and the electronic element, with the shielding structure either embedded or disposed outside the cladding layer, to effectively reflect and weaken external electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single metal layer is used as the shielding layer, then the device complexity is reduced, but the electromagnetic shielding effectiveness deteriorates
Solution Approach 1:
The shielding structure is divided into multiple metal layers (first metal layer, second metal layer, third metal layer) with different materials and orientations. Each layer segments the shielding function to address different frequency ranges and EMI directions, improving overall shielding effectiveness without requiring a single complex structure
Solution Approach 2:
The patent employs composite material structure by combining different metal materials (such as copper, aluminum, nickel, stainless steel) in multiple layers. Each material contributes different electromagnetic properties, creating a composite shielding system that effectively counters various types of EMI while maintaining manageable device complexity
2Reliability
If multiple metal layers are added to the shielding structure, then the electromagnetic shielding effectiveness is improved, but the device complexity increases
Solution Approach 1:
Different metal layers are strategically positioned and oriented based on local shielding requirements. The first metal layer may be oriented horizontally to shield against vertical EMI, while the second layer is oriented vertically to shield against horizontal EMI. This local optimization approach improves shielding effectiveness without uniformly increasing complexity throughout the entire structure
Solution Approach 2:
The multiple metal layers are nested within the encapsulant structure, with each layer embedded in the encapsulant material. This nesting approach integrates the complex multi-layer shielding structure into the existing package architecture, reducing overall device complexity while maintaining shielding effectiveness
3Ease of manufacture
If the shielding structure is disposed outside the cladding layer, then the manufacturing process is simplified, but the shielding effectiveness against direct EMI exposure deteriorates
Solution Approach 1:
The shielding structure is positioned in a dimensional arrangement where it extends beyond the cladding layer in certain directions while remaining protected by the encapsulant from other directions. This multi-dimensional positioning allows the shielding structure to intercept EMI waves that approach from angles not blocked by the cladding layer, maintaining shielding effectiveness while preserving manufacturing simplicity
4Reliability
If the shielding structure is embedded in the cladding layer, then the shielding effectiveness is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The shielding structure is prepared and positioned in advance during the encapsulant molding process, before final curing and cooling. The encapsulant material is poured around the pre-positioned shielding structure, allowing for self-alignment and reducing the need for high-precision post-processing. This preliminary action approach improves shielding effectiveness while managing manufacturing precision requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the electromagnetic shielding effect, preventing EMI from reaching the electronic element and improving the reliability of the semiconductor package without requiring new materials or processes, thus reducing production costs.
Implementation Method 1
the shielding structure is located between the shielding layer and the electronic element, so that external electromagnetic interference is reflected away from the electronic element via multiple shielding mechanisms
Implementation Method 2
a shielding structure bonded to the cladding layer and covering the electronic element; and a shielding layer formed on the cladding layer, wherein the shielding structure is located between the shielding layer and the electronic element
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, then a cladding layer is formed to cover the electronic element, and a shielding layer is formed on the cladding layer to cover the electronic element. The cladding layer is bonded to a shielding structure, and the shielding structure is located between the shielding layer and the electronic element, so as to prevent the electronic element from being subjected to external electromagnetic interference via multiple shielding mechanisms of the shielding structure and the shielding layer.