Electronic Package Frame Maintains Substrate Distance
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Solution Overview
Problem
In wireless communication modules, the stacking process of substrates can alter the distance between the circuit board and the antenna substrate, affecting antenna function and reducing product yield due to the melting of solder balls during reflow.
Innovation Solution
An electronic package design featuring a frame on the first substrate that encloses a supporter, allowing stable stacking with a consistent distance, using a thermosetting bonding material within the frame to secure the supporter, which maintains the required distance between substrates even during reflow processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is stacked on the circuit board via solder bumps and then flipped for reflow, then the solder balls are melted and reflowed to secure the stacking, but the distance between the circuit board and the substrate changes, affecting antenna function
Solution Approach 1:
The frame is formed on the first substrate before stacking the second substrate. This preliminary structure provides a reference for maintaining the required distance between substrates during subsequent reflow processes, preventing distance changes that would affect antenna function
Solution Approach 2:
The frame acts as an intermediary structure between the two substrates. It provides a stable reference framework that maintains the required distance during stacking and reflow, preventing direct contact and distance variation between the substrates
2Ease of manufacture
If the distance between the circuit board and substrate is not controlled, then the stacking process is simpler, but the antenna function is affected and product yield is reduced
Solution Approach 1:
The frame structure on the first substrate automatically maintains the required distance during stacking and reflow processes. The structure serves itself to control the distance without requiring additional active control mechanisms, ensuring antenna function while maintaining manufacturing simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures the antenna structure's functionality is preserved, preventing yield reduction by maintaining the necessary distance between substrates, simplifying the fabrication process, and reducing costs.
Implementation Method 1
the melting of solder balls during reflow
Implementation Method 2
The melted solder balls change the distance L between the circuit board 10 and the substrate 12
Data Source
AI summary
An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.