Electronic Package Structure for Liquid Metal Heat Isolation
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Solution Overview
Problem
Conventional encapsulant systems in electronic packages suffer from poor thermal conductivity, leading to inadequate heat dissipation, which can damage the die and result in short-circuit issues due to the high fluidity of liquid metal used as a heat transfer medium between the die and heat-dissipating plate.
Innovation Solution
An electronic package structure incorporating a substrate, insulating film, insulating glue, liquid metal, and a heat-dissipating plate, where the insulating film and glue prevent overflowing liquid metal from contacting adjacent components, thereby isolating and protecting them while facilitating effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid metal is used as heat transfer medium between die and heat-dissipating plate, then heat dissipation efficiency is improved, but liquid metal overflows and causes short-circuit damage
Solution Approach 1:
An insulating film is introduced as an intermediary layer between the liquid metal and surrounding electronic components. This mediator allows thermal energy transfer while preventing direct contact between the conductive liquid metal and sensitive circuits, thus maintaining heat dissipation efficiency while eliminating short-circuit risks
Solution Approach 2:
A thin insulating film is applied to cover the liquid metal layer. This thin film structure provides effective electrical insulation and containment of the liquid metal, preventing overflow damage while maintaining close thermal contact for efficient heat transfer from the die
2Ease of manufacture
If conventional encapsulant system is used for coating the die, then manufacturing simplicity is maintained, but thermal conductivity is poor leading to inadequate heat dissipation
Solution Approach 1:
The thermal conductivity parameter of the encapsulant material is changed from conventional low-conductivity materials to high-conductivity liquid metal. This parameter change enables effective heat dissipation while the liquid metal's fluidity allows it to conform to the die surface, maintaining ease of application
Solution Approach 2:
The system uses a composite structure combining the insulating film material with the liquid metal thermal interface material. This composite approach provides both the thermal conductivity needed for heat dissipation and the electrical insulation required for safety, while remaining manufacturable through sequential application of materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively dissipates heat and prevents short-circuit damage by isolating the liquid metal, enhancing the reliability of electronic components and circuits through a stable heat dissipation mechanism.
Implementation Method 1
liquid metal is disposed on the first electronic component. The heat-dissipating plate is disposed on the first electronic component and squeezes the liquid metal
Implementation Method 2
The insulating film is disposed on the second electronic component and the substrate. The insulating glue is disposed on the second electronic component and the substrate, and the insulating glue covers at least part of the insulating film
Data Source
AI summary
Provided is an electronic package structure, including a substrate, a first electronic component disposed on the substrate, at least one second electronic component disposed on the substrate, an insulating film disposed on the second electronic component and the substrate, an insulating glue filled onto the second electronic component and the substrate to cover at least part of the insulating film, a liquid metal disposed on the first electronic component, and a heat-dissipating plate disposed on the first electronic component to squeeze the liquid metal. The insulating film and the insulating glue prevent the overflowing liquid metal from contacting the second electronic component and the substrate.