Electronic Package Layout With Isolated Heat Dissipation Path
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Solution Overview
Problem
Conventional semiconductor packages face overheating issues due to the poor heat dissipation efficiency of encapsulants, which can damage semiconductor chips and reduce product reliability.
Innovation Solution
The electronic package design separates the electronic element and heat dissipation member into distinct areas on the carrier structure, with the heat dissipation member thermally connected to the element to prevent heat energy from conducting into the encapsulation layer, ensuring effective heat dissipation and avoiding overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat dissipation member and encapsulant are disposed at the same place on the package substrate, then the structure is compact and simple, but heat energy conducts to the encapsulant causing overheating around the semiconductor chip
Solution Approach 1:
The patent divides the package substrate into distinct functional zones: an encapsulation area for the semiconductor chip and encapsulant, and a separate functional area for the heat dissipation member. This spatial segmentation prevents heat energy from conducting into the encapsulant while maintaining effective heat dissipation from the chip, thus resolving the contradiction between compact structure and overheating prevention.
2Ease of manufacture
If conventional encapsulant material is used, then the manufacturing process is simple, but the heat dissipation efficiency is poor with thermal conductivity of only 0.8 W·m−1·k−1
Solution Approach 1:
The patent extracts the heat dissipation function from the encapsulant material and assigns it to a dedicated heat dissipation member made of high thermal conductivity material. This allows the encapsulant to maintain its simple manufacturing properties while the separate heat dissipation member provides efficient heat transfer, resolving the contradiction between manufacturing simplicity and heat dissipation efficiency.
3Temperature
If the heat dissipation member is bonded to the semiconductor chip, then heat can be conducted away from the chip, but heat energy also conducts to the encapsulant via the supporting leg causing overheating
Solution Approach 1:
The patent applies local quality by creating a localized heat dissipation path through the heat dissipation member that is thermally coupled to the chip's heat-generating area. The member's high thermal conductivity material provides a preferential heat flow path away from the chip, concentrating heat dissipation in a specific direction and preventing heat from spreading to the encapsulant, thus resolving the overheating issue while maintaining effective heat removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents overheating around the electronic element, enhancing the reliability and heat dissipation efficiency of the semiconductor package by isolating the heat dissipation path from the encapsulation layer.
Implementation Method 1
the heat energy generated by the electronic element can be prevented from conducting into the encapsulation layer during the heat dissipation process
Implementation Method 2
the encapsulation layer is free from being formed on the functional area... preventing heat energy from conducting into the encapsulation layer
Data Source
AI summary
An electronic package is provided, in which an electronic element and a heat dissipation member are disposed on different areas of a carrier structure having a heat dissipation layer, where the electronic element is covered by an encapsulation layer, and the heat dissipation member is thermally connected to the electronic element via the heat dissipation layer, so that the heat energy generated by the electronic element can be prevented from conducting into the encapsulation layer during the heat dissipation process, such that the problem of overheating around the electronic element can be avoided.