Heterogeneous Electronic Package With Intermediate Circuit Board
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages are limited in their ability to heterogeneously integrate multiple electronic elements with an optical engine module, leading to suboptimal data transmission performance, increased insertion and power loss, and warpage issues during production.
Innovation Solution
The electronic package integrates a first circuit structure with at least one high bandwidth memory chip, a switch die or application specific integrated circuit, and an optical engine module, all of which are electrically connected to the first circuit structure and a carrier structure, allowing for heterogeneous integration and improved connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the switch die and optical engine module are directly disposed on the left and right sides of the package substrate in a side by side manner, then the package structure is simple, but the package substrate becomes difficult to control warpage and the spacing is too large causing large insertion loss and power loss
Solution Approach 1:
The patent introduces an intermediate circuit board between the switch die and optical engine module. This intermediate board acts as a mediator that reduces the spacing between components, thereby reducing insertion loss and power loss, while also serving as a support structure to control warpage of the package substrate.
Solution Approach 2:
The patent transitions from a two-dimensional side-by-side arrangement to a three-dimensional stacked configuration. The switch die and optical engine module are vertically stacked on the intermediate circuit board, which reduces the horizontal spacing and allows for better warpage control while maintaining electrical connectivity through vertical interconnects.
2Device complexity
If only switch die and optical engine module are integrated in the package, then the package structure is simple, but the data transmission performance cannot be improved further
Solution Approach 1:
The intermediate circuit board is designed to provide multiple functions: it serves as a mechanical support structure, an electrical interconnection platform, and a spacing reducer. This multi-functional design enables the integration of additional components while maintaining system performance and managing complexity.
Solution Approach 2:
The patent segments the package into multiple functional layers: the package substrate, the intermediate circuit board, and various electronic components (switch die, optical engine module, and additional electronic elements). This segmentation allows for independent optimization of each layer and enables heterogeneous integration of multiple component types.
3Ease of operation
If the spacing between switch die and optical engine module is increased, then the package structure is relaxed, but large insertion loss and power loss occur under high-speed operation
Solution Approach 1:
The intermediate circuit board serves as a mediator that provides optimized trace routing between the switch die and optical engine module. The board's circuit traces are designed to minimize signal loss while maintaining manageable spacing, and the board itself provides mechanical support that enables precise positioning.
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which at least one first electronic element, at least one second electronic element and an optical engine module are all disposed or heterogeneously integrated on a first circuit structure and are electrically connected to the first circuit structure. Furthermore, the first circuit structure is disposed on a carrier structure, so that the first circuit structure and the first electronic element, the second electronic element and the optical engine module on the first circuit structure are carried by the carrier structure, and the first electronic element, the second electronic element and the optical engine module are all electrically connected to the carrier structure via the first circuit structure. Therefore, the electronic package can improve data transmission performance, reduce insertion loss/power loss, or reduce the warpage problem.