Electronic Package Intermetallic Bonding for Heat Dissipation
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Solution Overview
Problem
Conventional electronic packages face challenges with increased process costs due to additional nickel layers and poor bonding of thermal interface materials, leading to inadequate heat dissipation and reliability issues.
Innovation Solution
The electronic package incorporates a heat conductor sandwiched between the electronic component and the heat dissipation structure, with first and second intermetallic compound layers formed between these components, along with a metal anti-oxidation layer on the outer surface of the heat dissipation structure to save process costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional nickel layers and nickel/gold layers are plated on the heat sink surface, then oxidation prevention and bonding effectiveness are improved, but process cost increases
Solution Approach 1:
The patent removes the nickel/gold layer from the heat sink surface, extracting only the essential bonding function. The heat sink uses a single nickel layer for both oxidation prevention and bonding, eliminating the costly nickel/gold plating process while maintaining reliability.
Solution Approach 2:
The patent applies different surface treatments to different regions of the heat sink. The bonding surface uses a nickel layer with controlled thickness and morphology for effective bonding, while other surfaces maintain oxidation resistance. This localized approach optimizes both bonding and cost without requiring uniform expensive plating across the entire heat sink.
2Temperature
If thermal interface material is used to bond the heat sink to the semiconductor chip, then heat dissipation is improved, but bonding reliability deteriorates due to ineffective bonding
Solution Approach 1:
The patent introduces a nickel layer as an intermediary between the heat sink and thermal interface material. This nickel layer serves as a bonding mediator that chemically bonds to both the heat sink substrate and the thermal interface material, ensuring reliable mechanical and thermal connection while maintaining effective heat dissipation.
Solution Approach 2:
The patent creates a composite bonding structure consisting of the nickel layer combined with thermal interface material. This composite approach leverages the metallurgical bonding capability of nickel while incorporating the thermal conductivity and interface filling properties of the thermal interface material, achieving both reliable bonding and effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation by forming stable connections between the heat dissipation structure, heat conductor, and electronic component, while reducing process costs by minimizing the need for additional nickel layers.
Implementation Method 1
a heat conductor disposed on the electronic component; a heat dissipation structure disposed on the electronic component, wherein the heat conductor is sandwiched between the electronic component and the heat dissipation structure
Implementation Method 2
a first intermetallic compound layer formed between the heat dissipation structure and the heat conductor; and a second intermetallic compound layer formed between the heat conductor and the electronic component
Implementation Method 3
a metal anti-oxidation layer formed on an outer surface of the heat dissipation structure
Data Source
AI summary
An electronic package is provided and includes: a carrier structure, an electronic component disposed on the carrier structure, a heat dissipation structure disposed on the electronic component, a heat conductor sandwiched between the electronic component and the heat dissipation structure, a first intermetallic compound layer formed between the heat dissipation structure and the heat conductor, and a second intermetallic compound layer formed between the heat conductor and the electronic component. Therefore, stable connections can be formed between the heat dissipation structure, the heat conductor and the electronic component via the first intermetallic compound layer and the second intermetallic compound layer to improve heat dissipation effect.