Electronic Package Laser Drilling Protective Layer
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Solution Overview
Problem
Conventional through molding via (TMV) methods for semiconductor packages face challenges in controlling laser power and speed near circuit layers, leading to potential damage and poor electrical connections, resulting in issues like short circuits or reduced reliability.
Innovation Solution
The method involves forming a protective layer on the carrier to buffer the laser drilling process, using a first laser to remove the covering layer and a second laser to create a through hole, thereby preventing direct damage to the circuit layer and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser drilling is used to form through holes in the encapsulant, then the circuit layer can be exposed and electrical connections can be established, but the circuit layer may be damaged due to uncontrolled laser power and time
Solution Approach 1:
A protective layer is formed on the circuit layer before laser drilling of the encapsulant. This preliminary protective action buffers the laser energy, preventing direct damage to the circuit layer while allowing the laser to effectively drill through the encapsulant and form precise through holes.
Solution Approach 2:
The protective layer serves as a cushioning layer between the laser beam and the circuit layer. It absorbs and disperses the laser energy, preventing excessive heat concentration that would damage the circuit layer, thereby ensuring both drilling precision and circuit layer integrity.
2Reliability
If laser power is reduced or drilling speed is reduced near the circuit layer to prevent damage, then the circuit layer is protected, but the through hole formation becomes less efficient
Solution Approach 1:
The protective layer is applied beforehand to enable high-power laser drilling through the encapsulant without damaging the circuit layer. This eliminates the need to reduce laser power or drilling speed near the circuit layer, maintaining high drilling efficiency while ensuring circuit layer protection.
Solution Approach 2:
The protective layer acts as an intermediary between the laser beam and the circuit layer, allowing the laser to maintain high power and drilling speed while the protective layer absorbs the excess energy, thus protecting the circuit layer without compromising drilling efficiency.
3Reliability
If the protective layer is formed to cover the circuit layer, then the circuit layer is protected from laser damage, but the structure becomes more complex
Solution Approach 1:
The protective layer serves multiple functions: it protects the circuit layer from laser damage during through hole formation, and it also provides mechanical support and environmental protection for the circuit layer in the final package structure. This multi-functionality justifies the additional structural element.
Solution Approach 2:
The protective layer is made of the same material as the encapsulant, maintaining material homogeneity throughout the package structure. This reduces complexity by using a single material type for both protection and encapsulation functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents damage to the circuit layer, improves electrical connections, and increases the reliability of the electronic package by using a protective layer to control the laser drilling process, allowing for faster and more precise formation of through holes.
Implementation Method 1
forming a first opening on the covering layer by using a first laser to expose the protective layer from the first opening
Implementation Method 2
forming a second opening on the protective layer by using a second laser to expose a portion of a surface of the second side of the carrier from the second opening
Data Source
AI summary
The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.