Electronic Package Metal TIM Structure for Better Heat Dissipation
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Solution Overview
Problem
Conventional polymeric thermal interface materials (TIMs) used in electronic devices have low thermal conductivity, leading to inefficient heat dissipation.
Innovation Solution
The use of a metallic thermal interface material (TIM) combined with an adhesive layer containing metal particles, which forms an intermetallic compound (IMC) for enhanced thermal conductivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a polymeric thermal interface material (TIM) is used to connect the electronic device to the heat spreading component, then the device can be easily manufactured and assembled, but the thermal conductivity is low resulting in inefficient heat dissipation
Solution Approach 1:
The patent uses a composite material structure consisting of a metallic TIM layer with high thermal conductivity combined with an adhesive layer containing metal particles. This composite structure achieves both high thermal conductivity (improving heat dissipation) and ease of manufacture (through standard deposition and bonding processes), resolving the contradiction between thermal performance and manufacturing simplicity.
Solution Approach 2:
The patent changes the material parameter from polymeric to metallic TIM, fundamentally altering the thermal conductivity parameter while maintaining manufacturability through established metal deposition techniques. This parameter change enables efficient heat dissipation without sacrificing ease of manufacture.
2Temperature
If a metallic thermal interface material (TIM) is used to improve thermal conductivity, then heat dissipation efficiency is improved, but the manufacturing cost increases due to expensive materials like gold
Solution Approach 1:
The patent applies local quality by placing metal particles specifically in the adhesive layer where they are most needed for thermal conduction, rather than using expensive metallic TIM throughout the entire structure. This localized application of metallic properties reduces overall material cost while maintaining high thermal conductivity at the critical interface.
Solution Approach 2:
The patent substitutes expensive gold layers with more cost-effective metal particles in the adhesive layer, achieving similar thermal performance at lower cost. This replacement of premium materials with more economical alternatives directly addresses the manufacturing cost concern while preserving thermal conductivity benefits.
3Reliability
If an adhesive layer with metal particles is used between the electronic component and thermal conductive element, then thermal conductivity and connection reliability are improved, but the device structure becomes more complex
Solution Approach 1:
The patent merges the adhesive function and thermal conduction function into a single integrated layer. The adhesive layer contains metal particles that simultaneously provide bonding strength and thermal pathways, eliminating the need for separate adhesive and TIM layers. This merging reduces structural complexity while improving both reliability and thermal performance.
Solution Approach 2:
The adhesive layer serves multiple functions: it provides mechanical bonding between components and acts as a thermal conduction pathway through embedded metal particles. This multi-functionality reduces the number of separate layers needed, simplifying the overall device structure while enhancing both connection reliability and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation and the reliability of connections between components, while also reducing manufacturing costs by eliminating the need for expensive gold layers.
Implementation Method 1
an intermetallic compound (IMC) between the first metal and the second metal
Implementation Method 2
a thermal conductive element above the electronic component, wherein thermal conductive element includes a first metal
Implementation Method 3
an adhesive layer between the electronic component and the thermal conductive element, wherein the first adhesive layer includes a second metal
Data Source
AI summary
An electronic package is provided in the present disclosure. The electronic package comprises: an electronic component; a thermal conductive element above the electronic component, wherein thermal conductive element includes a first metal; an adhesive layer between the electronic component and the thermal conductive element, wherein the first adhesive layer includes a second metal; and an intermetallic compound (IMC) between the first metal and the second metal.