Electronic Package Notch Design Prevents Shielding Layer Burr Formation

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Solution Overview

Problem

Conventional electronic packages face issues with burr formation during the removal of the shielding layer's portion to be removed, which reduces the yield of the electronic package.

Innovation Solution

The electronic package design includes a circuit layer with an encircled surface and a notch, where the shielding layer is formed with a first shielding portion that does not cover the space of the notch, allowing for the removal of the portion to be removed without leaving burrs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the shielding layer includes a portion to be removed that is connected to the covering portion, then the shielding layer can be formed to cover the electronic package, but burrs are formed when the portion to be removed is detached

Engineering Contradiction:

Improveyield of electronic packageVSAvoidburr formation

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies preliminary action by pre-forming a notch in the circuit layer at the detachment position before the shielding layer is applied. This notch serves as a predetermined separation path that guides the detachment process, preventing burr formation when the portion to be removed is separated from the covering portion. The notch is created in advance to ensure clean separation without damaging the electronic package.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent applies segmentation by dividing the shielding layer into two distinct parts: a covering portion that remains on the electronic package and a portion to be removed that is connected to the covering portion. The notch creates a clear separation line between these segments, allowing the portion to be removed to be detached cleanly without leaving burrs on the covering portion or the electronic package.

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If the portion to be removed is detached from the covering portion, then the carrier can be removed, but remaining material lowers the yield

Engineering Contradiction:

Improvecarrier removal processVSAvoidcleanliness of detachment

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The notch is pre-formed in the circuit layer to establish a predetermined detachment path before the shielding layer is applied and before the carrier removal process begins. This preliminary structure ensures that when the portion to be removed is detached, it separates cleanly along the notch line without leaving residual material that would compromise manufacturing precision or yield.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12317462B2Electronic package and method of manufacturing the same

Publication Date: 2025.05.27 CHIPBOND TECH

AI summary

In a method of manufacturing an electronic package, first grooves are formed on a circuit structure and a second groove is formed in each of the first grooves to allow the circuit structure to become circuit layers. Owing to the second groove is narrower than the first groove, each of the circuit layers has an encircled surface and a notch located on the encircled surface. When a shielding layer is provided to cover an encapsulating body located on the circuit layer, a space of the notch is not covered by the shielding layer such that a portion to be removed of the shielding layer will not remain on the electronic package to become burr after removing the portion to be removed.