Electronic Package Layout Using Partial Vias for Smaller Footprints
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Solution Overview
Problem
Conventional electronic packages with wire bonding have a limited minimum size, necessitating a need for miniaturization to meet the requirements of certain applications.
Innovation Solution
An electronic package design utilizing a first and second dielectric layer with inner contacts and partial vias, forming bottom and side contacts, allowing for a miniaturized footprint without wire bonding, and enabling packaging of multiple components while maintaining a minimal footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used for electrical connections, then manufacturing reliability is improved, but the minimum package size is increased
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the package structure. Instead of using separate wire bonds to connect the semiconductor die to leads, the invention integrates electrical connections directly into the substrate through vias and conductive paths, removing the need for wire bonding and thereby reducing package footprint while maintaining manufacturing reliability
Solution Approach 2:
The patent transitions from a planar wire bonding approach to a vertical three-dimensional connection architecture. Electrical connections are established through vias that penetrate the substrate vertically, allowing multiple connection points to be stacked in the vertical dimension rather than spread out horizontally, thus reducing the package footprint
2Area of stationary object
If the package footprint is reduced for miniaturization, then the area occupied is decreased, but the complexity of electrical connections increases
Solution Approach 1:
The patent merges multiple electrical connection functions into a single integrated substrate structure. The substrate combines through-holes, conductive paths, and mounting surfaces into one unified component, eliminating the need for separate wire bonds and connection elements. This consolidation reduces package footprint while managing connection complexity through integration rather than multiplication of separate components
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for the semiconductor die, establishes electrical connections through integrated vias and conductive paths, and offers mounting surfaces for external connections. This multi-functionality reduces the need for separate components and reduces overall package footprint while keeping the electrical connection system manageable
Data Source
AI summary
An electronic package having a miniaturized footprint and a method for manufacturing the same is provided. Due to the arrangement of bottom contacts of the electronic package using a first partial vias, a footprint is obtained that is miniaturized with respect to the known electronic package comprising a same-sized electronic component. The electronic package according to the present disclosure enables packaging multiple electronic components while nevertheless minimally increasing the footprint with respect to conventional electronic packages.