Electronic Package Layout With Separated Power and Signal Paths
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Solution Overview
Problem
In electronic packaging, the long power transmission path through substrates leads to significant voltage drops and performance degradation, and existing configurations where power and signal terminals share the active surface interfere with signal quality and increase power loss.
Innovation Solution
The electronic package design embeds the electronic component within a carrier that separates power and signal routing regions, using power vias to reduce the power path length and minimize interference, with power routing conducted through conductive layers within the carrier rather than additional structures, and signal routing through non-power vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power transmission is conducted through substrate routing features (conductive vias, conductive pads, conductive wires), then power can be transmitted to electronic components, but the long power routing path causes significant voltage drop and performance degradation
Solution Approach 1:
The patent transitions power transmission from planar substrate routing to three-dimensional vertical transmission through conductive pillars extending from the first substrate to the second substrate. This dimensional change dramatically shortens the power transmission path and eliminates voltage drop issues associated with long substrate routing paths.
Solution Approach 2:
The conductive pillars are embedded within recesses formed in the second substrate, creating a nested structure where the pillar fits into the recess. This nesting approach minimizes the exposed height of the conductive pillar while maintaining electrical connection, further reducing inductance and parasitic effects.
2Reliability
If power and signal terminals are located on the active surface of electronic components, then both can be connected, but they interfere with each other causing signal quality degradation and increased power loss
Solution Approach 1:
The patent spatially segments power and signal transmission paths by locating power input terminals and signal input terminals at different locations on the active surface of electronic components. Power is transmitted through conductive pillars while signals are routed through conductive traces on the substrate, physically separating these functions to eliminate interference.
Solution Approach 2:
The patent extracts power transmission from the planar substrate routing layer and implements it through vertical conductive pillars. This separation removes power routing from the substrate trace layer, eliminating interference between power and signal paths while simplifying substrate design.
3Length of stationary object
If additional conductive structures are added to reduce power path length, then power transmission improves, but manufacturing complexity and cost increase
Solution Approach 1:
The conductive pillars serve multiple functions: they provide mechanical support between substrates, establish electrical connection for power transmission, and define the vertical spacing between layers. This multi-functionality eliminates the need for separate structural and electrical elements, simplifying manufacturing.
Solution Approach 2:
The patent merges the power transmission function with the substrate stacking architecture by forming conductive pillars that extend between substrates. This integration combines what would otherwise be separate power delivery and mechanical support functions into a single unified structure.
Data Source
AI summary
An electronic package is provided. The electronic package includes a power regulating component, an electronic component, and a circuit structure. The circuit structure separates the power regulating component and the electronic component. The circuit structure is configured to provide a first power to the power regulating component. The power regulating component is configured to provide a second power to the electronic component through the circuit structure.