Electronic Package Routing Structure for Faster Chip Module Links
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Solution Overview
Problem
Conventional semiconductor packages have slow communication speeds between multiple chip packaging modules, which is inadequate for high-data-rate applications such as artificial intelligence and high-performance computing.
Innovation Solution
The electronic package includes a carrier component with a routing structure, a chip packaging module, an electronic element with contacts, and an electronic connector. The chip packaging module is electrically connected to the routing structure, and the electronic element and connector receive and transmit electrical signals, respectively, to enhance communication speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If communication between chip packaging modules is transmitted through the substrate structure, then the package structure is simple, but the transmission speed is slow
Solution Approach 1:
The patent divides the communication path into separate segments: the substrate structure handles power and ground connections, while dedicated signal transmission lines on the circuit board handle data communication. This segmentation allows each component to be optimized for its specific function, achieving high-speed communication without complicating the overall package structure.
Solution Approach 2:
The patent introduces an intermediary layer (circuit board with signal transmission lines) between the chip packaging modules to enable high-speed communication. This intermediary structure acts as a dedicated communication channel that bridges multiple modules while maintaining signal integrity and speed.
2Adaptability or versatility
If the package size is increased to accommodate high-performance computing elements, then more functional elements can be integrated, but the communication between chip packaging modules becomes more difficult
Solution Approach 1:
The patent transitions from two-dimensional communication through the substrate to a three-dimensional architecture where signal transmission lines extend across the circuit board surface. This dimensional change allows multiple chip packaging modules to be connected in a planar arrangement with dedicated communication paths, facilitating integration of more elements without increasing communication complexity.
Solution Approach 2:
The circuit board serves multiple functions simultaneously: it provides mechanical support for chip packaging modules, establishes electrical connections through the substrate structure, and enables high-speed communication through signal transmission lines. This multi-functionality allows the system to accommodate more elements without proportionally increasing communication complexity.
Data Source
AI summary
An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.