Electronic Package Shielding Wires for Low-Frequency EMI
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Solution Overview
Problem
Conventional RF module shielding methods using a single layer of metal thin film are inadequate for effectively reducing electromagnetic interference (EMI) in high-frequency components, particularly for low-frequency components.
Innovation Solution
The implementation of crisscrossing shielding wires spanning across electronic components, connected to a carrier and encapsulated within a protective layer, which disrupts radiation paths and enhances EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single layer of metal thin film is used as the shielding layer, then the structure is simple and manufacturing is easy, but the EMI shielding effectiveness is insufficient especially for low-frequency components
Solution Approach 1:
The patent divides the shielding structure into multiple segments: multiple shielding wires arranged in parallel, with each wire acting as an independent shielding element. This segmentation allows the shielding function to be enhanced while maintaining manufacturing simplicity, as each wire can be individually positioned and connected
Solution Approach 2:
The patent transitions from a two-dimensional metal thin film to a three-dimensional wire array structure. The shielding wires extend vertically above the circuit board surface, creating multiple shielding planes at different heights, which enhances EMI shielding effectiveness particularly for low-frequency components while maintaining ease of manufacture
2Object-affected harmful factors
If multiple shielding layers are added to improve EMI shielding, then the shielding effectiveness increases, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The shielding wires serve multiple functions simultaneously: they provide EMI shielding, acts as bonding wires for electrical connection, and can be integrated with existing package substrates. This multi-functionality reduces overall device complexity while maintaining effective shielding
Solution Approach 2:
The patent merges the shielding function with the existing bonding wire structure. The shielding wires are integrated into the package substrate along with other components, combining multiple functions into a unified structure that reduces overall complexity rather than adding separate shielding layers
3Object-affected harmful factors
If metal thin film is applied on the periphery of the RF module, then EMI can be blocked in some circumstances, but the shielding is insufficient for low-frequency components and the structure increases manufacturing steps
Solution Approach 1:
The shielding wires are positioned and connected to the package substrate before final encapsulation. This preliminary positioning ensures proper alignment and electrical connection while simplifying the overall manufacturing process, as the shielding structure is integrated early in the assembly process rather than added as a separate post-processing step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves EMI shielding by disturbing radiation paths and providing better protection for both high and low-frequency components, especially when shielding wires are embedded within the encapsulating layer.
Implementation Method 1
the plurality of shielding wires crisscross one another... irregular paths formed by the crisscrossing shielding wires disturb the radiation paths, so that smaller amounts of electromagnetic radiations can be obtained, and shielding against EMI can thus be improved
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.