Metal-Cap Electronic Package Side Shielding for EMI Coverage

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Solution Overview

Problem

Electronic chips lack comprehensive shielding from electromagnetic radiation, particularly from the side direction, which can affect their performance and reliability.

Innovation Solution

Implementing a metallic sheet at the base of an electronic component and attaching it to a metallic cap on at least one side, creating a shield that extends from the top, bottom, and sides to protect the chip from electromagnetic radiation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If comprehensive shielding from all directions is implemented, then shielding coverage is improved, but device complexity increases

Engineering Contradiction:
Improveshielding coverageVSAvoidshielding structure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The metallic sheet serves multiple functions simultaneously: it provides side shielding, extends to form bottom shielding, and connects to the metallic cap to integrate the shielding system, thereby achieving comprehensive coverage with a unified structure rather than separate components for each direction

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides effective shielding from all directions, enhancing the protection of electronic chips from external electromagnetic radiation and improving their performance and reliability.

Implementation Method 1

a metallic sheet (14) which is fixed to the package base (12)... The first sheet side section (141) is in contact with the first cap side section (131) so that the first sheet side section (141) and first cap side section (131) together form a first side-shield (161) on the first side (171) of the enclosure (17)

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS12075603B2Shielded electronic component
Publication Date: 2024.08.27 MURATA MFG CO LTD
  • US12075603B2 patent drawing
  • US12075603B2 patent drawing
  • US12075603B2 patent drawing

AI summary

An electronic component comprising a package base and an at least partly metallic cap which is attached to the package base to form an enclosure. A metallic sheet is fixed to the package base. The metallic sheet comprises a sheet side section and the cap comprises a cap side section. The sheet side section is in contact with the cap side section so that they together form a side-shield on the side of the enclosure.