Electronic Package Interconnect Layout to Prevent Solder Bridging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packaging faces issues with bridging short circuits due to large solder balls, limiting the number of contacts and failing to meet high density requirements.
Innovation Solution
The use of smaller conductive pillars connected to a carrier structure and wiring structure via solder bumps, eliminating the risk of bridging short circuits and allowing for a higher number of contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used to connect substrate structure and wiring structure, then electrical connection is achieved, but the large size of solder balls causes them to contact each other resulting in bridging short circuits
Solution Approach 1:
The patent changes the size parameter of the connection elements from large solder balls to small conductive pillars. This parameter change reduces the diameter of connection elements, allowing higher density arrangement while eliminating the bridging short circuit problem caused by large solder balls contacting each other.
Solution Approach 2:
The patent replaces the traditional solder ball mechanical connection system with a conductive pillar system that integrates with the substrate structure. The conductive pillars are formed through semiconductor manufacturing processes (such as plating or sputtering) rather than mechanical placement, enabling more precise control and higher density.
2Reliability
If the number of solder balls is limited due to bridging risk, then bridging short circuits are avoided, but the number of contacts is insufficient to meet high density requirements
Solution Approach 1:
By changing the size parameter from large solder balls to small conductive pillars, the patent enables a significant increase in the number of contacts. The reduced diameter of conductive pillars allows for higher density arrangement on the substrate, meeting the high contact density requirements while maintaining reliable electrical connections.
3Ease of manufacture
If conventional packaging structures are used, then manufacturing simplicity is maintained, but the specification cannot meet high density of contacts requirement
Solution Approach 1:
The patent merges the conductive pillars with the substrate structure, forming an integrated structure where conductive pillars are directly formed on the substrate during the manufacturing process. This integration eliminates separate assembly steps while enabling high density contact arrangements, thus maintaining manufacturing simplicity while achieving high contact density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-density contacts by preventing bridging short circuits, thereby enhancing the semiconductor package's functionality and density.
Implementation Method 1
a plurality of solder bumps disposed on the first side of the carrier structure and electrically connected to the circuit layer
Data Source
AI summary
Provided are an electronic package and a manufacturing method thereof, including a plurality of solder bumps formed on a carrier structure having an electronic component disposed thereon, a plurality of conductive pillars disposed on the solder bumps, an encapsulating layer covering the electronic component, the solder bumps and the conductive pillars, a wiring structure formed on the encapsulating layer. The solder bumps are connected to the carrier structure, and the conductive pillars are connected to the wiring structure. Hence, the carrier structure and the wiring structure are connected to each other by the solder bumps and the conductive pillars, thereby the problem of bridging short circuit between the solder bumps can be avoided.