Electronic Package Structure for Reduced Soldering Stress
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Solution Overview
Problem
Electronic components, particularly MEMS devices, experience significant stress due to extreme temperature changes during the soldering process, which can lead to deformation and reliability issues.
Innovation Solution
Incorporating a solid support substance with embedded vertical columnar conductors that extend through the package, where the conductors' area is greater than 4% of the circuit board area, to mitigate temperature-induced deformations and strain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging structures are used during soldering, then manufacturing simplicity is maintained, but temperature-induced stress and deformation increase
Solution Approach 1:
The package structure is segmented into multiple functional layers: a rigid support board, a compliant solid support substance layer, and embedded columnar conductors. This segmentation allows each layer to perform its specific function - the rigid board provides structural support, the solid support substance absorbs thermal stress, and the columnar conductors provide electrical connections while accommodating deformation.
Solution Approach 2:
The package employs composite material construction by combining different materials with complementary properties: a rigid support board material for structural integrity, a solid support substance material for stress absorption and compliance, and conductor materials for electrical connectivity. This composite approach enables the package to simultaneously maintain structural rigidity and thermal stress compliance.
2Ease of manufacture
If soldering process is performed at high temperatures, then electrical connections are established, but temperature-related deformations and strain increase
Solution Approach 1:
The solid support substance undergoes parameter changes in response to temperature variations during soldering. Its compliant mechanical properties allow it to deform elastically under thermal stress, accommodating expansion and contraction of the support board and dies without causing permanent damage or misalignment.
Solution Approach 2:
The solid support substance acts as a pre-positioned cushioning layer between the rigid support board and the dies. During the soldering process, this cushioning layer absorbs and distributes thermal stresses before they can transmit to the fragile electronic components, preventing deformation and damage in advance.
3Reliability
If columnar conductors are embedded in solid support substance, then temperature deformations are reduced, but manufacturing complexity increases
Solution Approach 1:
The package structure merges multiple functions into a single integrated assembly: the solid support substance simultaneously provides mechanical compliance, thermal stress absorption, and conductor embedding/ support. The columnar conductors are integrated directly into the solid support substance, eliminating the need for separate conductor mounting structures and simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces temperature-related deformations and strain within the electronic devices, enhancing their reliability and performance by distributing stress more evenly.
Implementation Method 1
the solid support substance decreases temperature related deformations of the columnar conductors and the printed circuit board
Data Source
AI summary
A packaging arrangement is provided that suppresses stress induced by extreme temperature changes during the process of attaching the electronic component. The arrangement includes adding to the package columnar conductors embedded in a solid support substance.