Electronic Package Layout With Stacked Connector Integration
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Solution Overview
Problem
Current electronic packages for 5G antenna-in-package (AIP) face challenges in reducing size, weight, and increasing integration, particularly in accommodating connectors without occupying additional space, which is crucial for compact devices like smartphones.
Innovation Solution
The design involves a substrate with distinct regions for electronic components, where a connector is stacked over smaller components, with interconnect components extending through an encapsulant layer to facilitate electrical coupling, allowing for a more compact package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a connector is mounted on the substrate in a conventional electronic package, then electrical connectivity is achieved, but the package footprint and height increase
Solution Approach 1:
The connector is positioned within the vertical space occupied by the encapsulant layer and electronic components, effectively nesting the connector within the existing package volume rather than adding it laterally. This allows electrical connectivity to be achieved without increasing the package footprint.
Solution Approach 2:
The connector is transitioned from a lateral mounting approach (increasing footprint) to a vertical stacking approach (utilizing height dimension). By extending interconnect components through the encapsulant layer and mounting the connector above the electronic components, the solution moves the connector into the vertical dimension, reducing the horizontal footprint while maintaining connectivity.
2Adaptability or versatility
If more electronic components and connectors are integrated into the package, then functionality is improved, but the package size increases
Solution Approach 1:
The patent transitions from a two-dimensional lateral arrangement of components to a three-dimensional vertical stacking configuration. Electronic components are arranged in multiple layers with interconnect components extending vertically through the encapsulant layer, enabling higher integration density without proportionally increasing package volume.
Solution Approach 2:
The encapsulant layer serves multiple functions simultaneously: it provides mechanical support, electrical insulation, and a mounting substrate for interconnect components. This merging of functions reduces the need for separate structural elements, thereby reducing overall package volume while maintaining integration capability.
3Length of stationary object
If the package thickness is reduced for compact devices, then device portability is improved, but manufacturing complexity increases
Solution Approach 1:
Interconnect components are positioned and secured to the substrate before the encapsulant layer is formed. This preliminary action ensures precise alignment and connection integrity, while the subsequent encapsulation process automatically provides protection and structural support, simplifying the overall manufacturing process despite the reduced thickness.
Solution Approach 2:
The encapsulant layer is designed to serve multiple purposes: encapsulating electronic components for protection, providing a mounting surface for interconnect components, and enabling vertical stacking of the connector. This multi-functionality allows the package to achieve reduced thickness without requiring additional specialized manufacturing steps.
Data Source
AI summary
An electronic package is provided. The electronic package comprises a substrate having a first region and a second region; a first set of electronic components mounted on the substrate in the first region; a second set of electronic components mounted on the substrate in the second region; an encapsulant layer disposed on the substrate and encapsulating the first and second sets of electronic components; a set of interconnect components disposed on the substrate in the second region, and extending through the encapsulant layer, wherein the set of interconnect components are electrically coupled to the first and second sets of electronic components; and a connector mounted on the encapsulant layer and electrically coupled to the first and second sets of electronic components through the set of interconnect components.