Electronic Package Structure for Thermal Stress Relief
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Solution Overview
Problem
Electronic components, especially MEMS devices, are susceptible to stress induced by extreme temperature changes during the soldering process, which can lead to mechanical deformation and reliability issues.
Innovation Solution
Incorporating columnar conductors embedded in a solid support substance within the electronic component package, which reduces temperature-related deformations and strain by distributing the thermal stress across the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging without solid support substance is used, then device complexity is reduced, but stress and reliability deteriorate under temperature changes
Solution Approach 1:
A solid support substance is introduced as an intermediary material between the columnar conductors and the surrounding environment. This mediator absorbs and distributes thermal stress, protecting the columnar conductors and connected electronic devices from temperature-induced deformation while maintaining overall package integrity.
Solution Approach 2:
The package structure combines multiple materials with different properties: a solid support substance (such as epoxy or polymer) integrated with columnar conductors and electronic devices. This composite structure leverages the stress-absorbing properties of the solid material to protect sensitive components during thermal cycling.
2Stress or pressure
If columnar conductors are added to the package, then stress distribution improves, but device complexity increases
Solution Approach 1:
The package is segmented into distinct functional zones: columnar conductors embedded in solid support substance, separate electronic devices, and defined interconnection regions. This segmentation allows each component to perform its specific function while collectively managing thermal stress through distributed architecture.
Solution Approach 2:
Columnar conductors extend in the vertical dimension through the solid support substance, creating three-dimensional stress distribution pathways. This vertical dimension adds redundant stress management routes, dispersing thermal loads across multiple spatial dimensions rather than relying solely on planar structures.
3Manufacturing precision
If solid support substance is used, then temperature-related deformations are reduced, but manufacturing complexity increases
Solution Approach 1:
The solid support substance is prepared and positioned in advance before final assembly steps. Columnar conductors are pre-embedded in the solid material, and the entire assembly is prepared for subsequent bonding operations. This preliminary preparation ensures proper stress distribution is established before final device attachment.
Solution Approach 2:
The solid support substance undergoes parameter changes during manufacturing, particularly in its bonding characteristics. The material is applied in a state that allows for controlled bonding to substrates and devices, with parameters such as temperature, pressure, and curing time optimized to achieve both stress distribution and manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively minimizes stress and enhances the reliability of electronic components by evenly distributing thermal stress across the circuit board, improving their performance and durability under varying temperature conditions.
Implementation Method 1
the solid support substance decreases temperature related deformations of the columnar conductors and the printed circuit board, reducing thereby strain inside the electronic devices
Data Source
Figure 1
Figure 2a~2c
Figure 3a~3c
AI summary
This disclosure describes a packaging arrangement that allows the suppression of the stress induced by extreme temperature changes during the process of attaching the electronic component. The result is achieved by adding to the package columnar conductors embedded in a solid support substance.